TC365DP64F300WAAKXUMA1 Infineon Technologies IC MCU 32BIT 4MB FLASH 176LQFP

label:
2025/09/16 37
TC365DP64F300WAAKXUMA1 Infineon Technologies  IC MCU 32BIT 4MB FLASH 176LQFP


CATALOG
TC365DP64F300WAAKXUMA1 COUNTRY OF ORIGIN
TC365DP64F300WAAKXUMA1 PARAMETRIC INFO
TC365DP64F300WAAKXUMA1 PACKAGE INFO
TC365DP64F300WAAKXUMA1 MANUFACTURING INFO
TC365DP64F300WAAKXUMA1 PACKAGING INFO
TC365DP64F300WAAKXUMA1 ECAD MODELS


COUNTRY OF ORIGIN
Singapore
Taiwan (Province of China)
Germany


PARAMETRIC INFO
Family Name AURIX
Data Bus Width (bit) 32
Device Core TriCore
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 300
Program Memory Type Flash
Program Memory Size 4MB
RAM Size 672KB
Maximum CPU Frequency (MHz) 300
Floating Point Unit Yes
DMA Channels 64
Number of Timers 1
ADC Channels 14
ADC Resolution (bit) 10
Number of ADCs 1
Real Time Clock Yes
Interface Type CAN/Ethernet/FlexRay/HSSL/I2C/LIN/SENT/SI5/SPI
SPI 4
I2C 1
I2S 1
UART 0
USART 0
CAN 8
USB 0
Ethernet 1
Maximum Power Dissipation (mW) 1080
Minimum Operating Supply Voltage (V) 2.97|4.5
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 3.63|5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Temperature Flag Opr
Operating Supply Voltage (V) 3.3|5


PACKAGE INFO
Supplier Package LQFP EP
Basic Package Type Lead-Frame SMT
Pin Count 176
Lead Shape Gull-wing
PCB 176
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 24
Package Width (mm) 24
Package Height (mm) 1.4
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Low Profile Quad Flat Package, Exposed Pad
Package Family Name QFP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 500


ECAD MODELS


Продукт RFQ