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• Wide Operating Range- 3V to 18V
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• Increased Output Current (40mA)
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• Pin Compatible with ICL7662/SI7661/TC7660/LTC1044
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• No External Diodes Required
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• Low Output Impedance @ IL = 20mA- 40 Typ.
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• No Low-Voltage Terminal Required
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• CMOS Construction
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• Available in 8-Pin PDIP and 8-Pin CERDIPPackages
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| CATALOG |
TC7662ACPA COUNTRY OF ORIGIN
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TC7662ACPA PARAMETRIC INFO
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TC7662ACPA PACKAGE INFO
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TC7662ACPA MANUFACTURING INFO
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TC7662ACPA PACKAGING INFO
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TC7662ACPA ECAD MODELS
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TC7662ACPA APPLICATIONS
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COUNTRY OF ORIGIN
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Thailand
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PARAMETRIC INFO
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| Function |
Inverting |
| Efficiency (%) |
97(Typ) |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
18 |
| Output Voltage (V) |
-3 to -18 |
| Maximum Supply Current (mA) |
0.7 |
| Output Type |
Adjustable |
| Output Current (mA) |
40 |
| Switching Frequency (kHz) |
12(Typ) |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Maximum Power Dissipation (mW) |
730 |
| Process Technology |
CMOS |
| Supplier Temperature Grade |
Commercial |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
PDIP |
| Basic Package Type |
Through Hole |
| Pin Count |
8 |
| Lead Shape |
Through Hole |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.79(Max) |
| Package Length (mm) |
10.16(Max) |
| Package Width (mm) |
6.6(Max) |
| Package Height (mm) |
4.06(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
5.08(Max) |
| Mounting |
Through Hole |
| Package Material |
Plastic |
| Package Description |
Plastic Dual In Line Package |
| Package Family Name |
DIP |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
60 |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • Laptop Computers |
| • Disk Drives |
| • Process Instrumentation |
| • P-based Controllers |
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