TCA6408ARSVR Texas Instruments TCA6408A Low-Voltage 8-Bit I2C and SMBus I/O Expander With Interrupt Output, Reset, and Configuration Registers

label:
2025/04/25 208
TCA6408ARSVR Texas Instruments TCA6408A Low-Voltage 8-Bit I2C and SMBus I/O Expander With Interrupt Output,  Reset, and Configuration Registers


• Operating power-supply voltage range of 1.65 V to 5.5 V
• Allows bidirectional voltage-level translation and gpio expansion between 1.8-V, 2.5-V, 3.3-V, and 5-V I2C bus and P-ports
• Low standby current consumption of 1 μA
• 5-V Tolerant I/O ports
• 400-kHz Fast I2C bus
• Hardware address pin allows two TCA6408A Devices on the same I2C/SMBus bus
• Input and output configuration register


CATALOG
TCA6408ARSVR COUNTRY OF ORIGIN
TCA6408ARSVR PARAMETRIC INFO
TCA6408ARSVR PACKAGE INFO
TCA6408ARSVR MANUFACTURING INFO
TCA6408ARSVR PACKAGING INFO
TCA6408ARSVR ECAD MODELS
TCA6408ARSVR APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Number of Segments 4
Minimum Operating Supply Voltage (V) 2.7
Typical Operating Supply Voltage (V) 3.3|5
Maximum Operating Supply Voltage (V) 5.5
Maximum Supply Current (uA) 1000(Typ)
Output Voltage (V) 2.7 to 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Operating Supply Voltage (V) 2.7 to 5.5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package DSBGA
Basic Package Type Ball Grid Array
Pin Count 12
Lead Shape Ball
PCB 12
Tab N/R
Pin Pitch (mm) 0.4
Package Length (mm) 1.65(Max)
Package Width (mm) 1.25(Max)
Package Height (mm) 0.48(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.68(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Die Size Ball Grid Array
Package Family Name BGA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) SnAgCu
Under Plating Material N/A
Terminal Base Material N/A


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 250
Packaging Document Link to Datasheet


ECAD MODELS


APPLICATIONS
• Servers
• Routers (telecom switching equipment)
• Personal computers
• Personal electronics (gaming consoles)
• Industrial automation
• Products with GPIO-limited processors
Продукт RFQ