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• AEC-Q100 (Grade 1) Qualified for automotive applications
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• Meets the requirements of ISO 11898-2:2016 physical layer standard
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• TCAN1044AV I/O voltage range supports 1.7V to 5.5V
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• Support for 12V and 24V battery applications
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• Receiver common mode input voltage: ±12V
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• 8-Pin SOIC, small footprint SOT-23 and leadless VSON-8 package with improved automated optical inspection (AOI) capability
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CATALOG |
TCAN1044AVDRBRQ1 COUNTRY OF ORIGIN
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TCAN1044AVDRBRQ1 PARAMETRIC INFO
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TCAN1044AVDRBRQ1 PACKAGE INFO
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TCAN1044AVDRBRQ1 MANUFACTURING INFO
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TCAN1044AVDRBRQ1 PACKAGING INFO
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TCAN1044AVDRBRQ1 ECAD MODELS
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TCAN1044AVDRBRQ1 APPLICATIONS
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COUNTRY OF ORIGIN
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China
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PARAMETRIC INFO
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Category |
Transceiver |
Maximum Data Rate |
8Mbps |
Standard Supported |
ISO 11898-2 |
Number of Transceivers |
1 |
Power Down Mode |
Normal|Standby |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
150 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
Typical Operating Supply Voltage (V) |
5 |
Minimum Operating Supply Voltage (V) |
4.5 |
Maximum Operating Supply Voltage (V) |
5.5 |
Maximum Supply Current (mA) |
130 |
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PACKAGE INFO
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Supplier Package |
VSON EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
No Lead |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
3.1(Max) |
Package Width (mm) |
3.1(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.1(Max) |
Package Overall Width (mm) |
3.1(Max) |
Package Overall Height (mm) |
1(Max) |
Seated Plane Height (mm) |
1(Max) |
Mounting |
Surface Mount |
Terminal Width (mm) |
0.36(Max) |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Thin Small Outline No Lead, Exposed Pad |
Package Family Name |
SON |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
Maximum PACKAGE_DIMENSION_H |
0.95 |
Minimum PACKAGE_DIMENSION_H |
N/A |
Maximum PACKAGE_DIMENSION_L |
3.1 |
Minimum PACKAGE_DIMENSION_L |
2.9 |
Maximum PACKAGE_DIMENSION_W |
3.1 |
Minimum PACKAGE_DIMENSION_W |
2.9 |
Maximum Diameter |
N/R |
Minimum Diameter |
N/R |
Maximum Seated_Plane_Height |
1 |
Minimum Seated_Plane_Height |
N/A |
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MANUFACTURING INFO
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MSL |
2 |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
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PACKAGING INFO |
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ECAD MODELS |
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APPLICATIONS |
• Automotive and transportation– Body control modules– Automotive gateway– Advanced driver assistance system (ADAS)– Infotainment |
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