|
|
• Highest Energy per volume
|
• Fast DCL Drop after mounting
|
• Low ESR
|
• Standard Undertab or J-lead termination
|
• High Volumetric Efficiency
|
• Low profile case sizes
|
|
| CATALOG |
TCN4107M035R0100E COUNTRY OF ORIGIN
|
TCN4107M035R0100E PARAMETRIC INFO
|
TCN4107M035R0100E PACKAGE INFO
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TCN4107M035R0100E MANUFACTURING INFO
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TCN4107M035R0100E PACKAGING INFO
|
TCN4107M035R0100E APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Czechia
|
|
PARAMETRIC INFO
|
| Capacitance Value |
100uF |
| Voltage |
35VDC |
| Tolerance |
20% |
| Ripple Current (A) |
1.38 |
| Case Code |
4 |
| Leakage Current (uA) |
350 |
| Equivalent Series Resistance (Ohm) |
0.1 |
| Case Style |
Molded |
| Fail Safe with Built-in Fuse |
No |
| High Shock and Vibrating |
Yes |
| Polarity |
Polar |
| Construction |
Flat |
| Operating Temperature (°C) |
-55 to 105 |
| Maximum Operating Temperature (°C) |
105 |
| Minimum Operating Temperature (°C) |
-55 |
| Equivalent Series Resistance Type |
Low |
| DC Rated Voltage (VDC) |
35 |
| Negative Capacitance Tolerance (%) |
-20 |
| Positive Capacitance Tolerance (%) |
20 |
| Maximum Storage Temperature (°C) |
50 |
| Maximum Dissipation Factor (%) |
10 |
| Tradename |
J-CAP™ |
| Type |
Polymer |
| Equivalent Series Inductance (nH) |
2.2 |
| Package Region |
World Wide |
| Special Features |
High Capacitance in Smaller Dimensions|High PCB Assembly Density|High Volumetric Efficiency|Lower ESR |
| Fixed/Variable |
Fixed |
|
|
PACKAGE INFO
|
| Mounting |
Surface Mount |
| Termination Style |
Undertab |
| Package/Case |
7361-20 |
| Product Length (mm) |
7.3 |
| Product Depth (mm) |
6.1 |
| Product Height (mm) |
2(Max) |
| Product Diameter (mm) |
N/R |
| Product Weight (g) |
0.355 |
| Number of Terminals |
2 |
| Size (mm) |
7.3 X 6.1 X 2 |
| Maximum Product Height (mm) |
2 |
|
|
| MANUFACTURING INFO |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Packaging Document |
Link to Datasheet |
|
| |
| APPLICATIONS |
| • Power Backup for SSDs (MLC, SLC,EFD, PCIe) |
| • Battery-Powered Portable Equipment |
| • Industrial Alarms Smart Power Meters |
| • Mobile Devices |
| |
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