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• Ultra-Low 1.6 nV/√Hz Voltage Noise
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• High Speed:
– 100-MHz Bandwidth [G = 2 (–1), –3 dB]
– 100-V/μs Slew Rate
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• Very Low Distortion
– THD = –72 dBc (f = 1 MHz, RL = 150 Ω)
– THD = –90 dBc (f = 1 MHz, RL = 1 kΩ)
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• Low 0.5-mV (Typical) Input Offset Voltage
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• 90-mA Output Current Drive (Typical)
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• Typical Operation from ±5 V to ±15 V
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• Available in Standard SOIC and MSOPPowerPAD™, Package
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|
| CATALOG |
| THS4031IDR COUNTRY OF ORIGIN |
THS4031IDR PARAMETRIC INFO
|
THS4031IDR PACKAGE INFO
|
THS4031IDR MANUFACTURING INFO
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THS4031IDR PACKAGING INFO
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THS4031IDR ECAD MODELS
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THS4031IDR APPLICATIONS
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COUNTRY OF ORIGIN
|
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Manufacturer Type |
High Speed Amplifier |
| Type |
High Speed Amplifier |
| Minimum Single Supply Voltage (V) |
9 |
| Number of Channels per Chip |
1 |
| Process Technology |
BiCOM |
| Minimum PSRR (dB) |
85 |
| Typical Single Supply Voltage (V) |
12|15|18|24|28 |
| Maximum Single Supply Voltage (V) |
32 |
| Minimum Dual Supply Voltage (V) |
±4.5 |
| Typical Gain Bandwidth Product (MHz) |
120 |
| Maximum Input Offset Voltage (mV) |
2@±5V |
| Typical Dual Supply Voltage (V) |
±5|±9|±12|±15 |
| Maximum Input Offset Current (uA) |
0.25@±5V |
| Maximum Dual Supply Voltage (V) |
±16 |
| Maximum Operating Supply Voltage (V) |
±16|32 |
| Maximum Input Bias Current (uA) |
6@±5V |
| Minimum CMRR (dB) |
90 |
| Maximum Supply Voltage Range (V) |
32 to 36 |
| Minimum CMRR Range (dB) |
90 to 95 |
| Typical Voltage Gain (dB) |
95 |
| Typical Slew Rate (V/us) |
80@±5V |
| Typical Settling Time (ns) |
80 |
| Typical Output Current (mA) |
70@±5V |
| Typical Input Noise Voltage Density (nV/rtHz) |
1.6@±5V |
| Typical Noninverting Input Current Noise Density (pA/rtHz) |
1.2@±5V |
| Shut Down Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Power Supply Type |
Single|Dual |
| Maximum Supply Current (mA) |
9@±5V |
| Maximum Power Dissipation (mW) |
629 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
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ECAD MODELS
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APPLICATIONS
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• Low-Noise, Wideband Amplifier for Industrial
Applications
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• Voltage-Controlled Oscillators
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• Active Filters
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• Video Amplifiers
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• Cable Drivers
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