|
|
• Triple 10-Bit D/A Converters
|
• 240-MSPS Operation
|
• Generic Triple DAC Mode for Non-Video Applications
|
• Direct Drive of Double-Terminated 75-Ω Load Into Standard Video Levels
|
• 3x10 Bit 4:4:4, 2x10 Bit 4:2:2 or 1x10 Bit 4:2:2 (ITU-R.BT656) Multiplexed YCbCr/GBR Input Data Formats
|
• Bi-Level (EIA) or Tri-Level (SMPTE) Sync Generation
|
|
| CATALOG |
THS8135PHP COUNTRY OF ORIGIN
|
THS8135PHP PARAMETRIC INFO
|
THS8135PHP PACKAGE INFO
|
THS8135PHP MANUFACTURING INFO
|
THS8135PHP PACKAGING INFO
|
THS8135PHP ECAD MODELS
|
THS8135PHP APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
Malaysia
|
Philippines
|
|
PARAMETRIC INFO
|
| Architecture |
Current Steering |
| Resolution |
10bit |
| Number of DAC Channels |
3 |
| Number of Outputs per Chip |
3 |
| Conversion Rate |
240Msps |
| Converter Type |
Video |
| Output Type |
Voltage |
| Voltage Reference |
Internal |
| Maximum Settling Time (us) |
0.015(Typ) |
| Interface Type |
Parallel |
| Output Polarity |
Unipolar |
| Integral Nonlinearity Error |
-2/1.5LSB |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Power Supply Type |
Analog and Digital |
| Minimum Single Supply Voltage (V) |
3 |
| Typical Single Supply Voltage (V) |
3.3 |
| Maximum Single Supply Voltage (V) |
3.6 |
| Digital Supply Support |
Yes |
| Maximum Power Dissipation (mW) |
394 |
|
|
PACKAGE INFO
|
| Supplier Package |
HTQFP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
48 |
| Lead Shape |
Gull-wing |
| PCB |
48 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
7.2(Max) |
| Package Width (mm) |
7.2(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
9.2(Max) |
| Package Overall Width (mm) |
9.2(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Quad Flat Package, Exposed Pad |
| Package Family Name |
QFP |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tray |
| Quantity Of Packaging |
250 |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • High-Definition Television (HDTV) Set-Top Boxes/Receivers/Displays |
| • High-Resolution Image Processing |
| |
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