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| CATALOG |
| TJA1101AHN/0Z COUNTRY OF ORIGIN |
TJA1101AHN/0Z PARAMETRIC INFO
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TJA1101AHN/0Z PACKAGE INFO
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TJA1101AHN/0Z MANUFACTURING INFO
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TJA1101AHN/0Z PACKAGING INFO
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Type |
Ethernet Transceiver |
| Maximum Data Rate |
100Mbps |
| Number of Channels per Chip |
1 |
| PHY Line Side Interface |
No |
| JTAG Support |
No |
| Standard Supported |
100BASE-T1 |
| Integrated CDR |
No |
| Number of Transceivers |
1 |
| Overhead Octet Support |
No |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Automotive |
|
|
PACKAGE INFO
|
| Supplier Package |
HVQFN EP |
| Pin Count |
36 |
| PCB |
36 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
6 |
| Package Width (mm) |
6 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
0.85 |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Family Name |
QFN |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
PdNiAg |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
Z |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
4000 |
| Packaging Document |
Link to Datasheet |
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