TL032CDR Texas Instruments IC OPAMP JFET 1.1MHZ 8SOIC

label:
2024/05/14 229

• Direct Upgrades for the TL06x Low-Power BiFETs
• Low Power Consumption...6.5 mW/Channel Typ
• On-Chip Offset-Voltage Trimming for Improved DC Performance(1.5 mV, TL031A)
• Higher Slew Rate and Bandwidth Without Increased Power Consumption
• Available in TSSOP for Small Form-Factor Designs
CATALOG
TL032CDR COUNTRY OF ORIGIN
TL032CDR PARAMETRIC INFO
TL032CDR PACKAGE INFO
TL032CDR MANUFACTURING INFO
TL032CDR PACKAGING INFO
TL032CDR EACD MODELS



COUNTRY OF ORIGIN
Mexico
China
Malaysia



PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Number of Channels per Chip 2
Process Technology BiFET
Maximum Quiescent Current (mA) 0.5@±5V
Minimum Dual Supply Voltage (V) ±5
Typical Gain Bandwidth Product (MHz) 1
Maximum Input Offset Voltage (mV) 3.5@±5V
Typical Dual Supply Voltage (V) ±9|±12
Maximum Input Offset Current (uA) 0.0001@±5V
Maximum Dual Supply Voltage (V) ±15
Maximum Operating Supply Voltage (V) ±15
Maximum Input Bias Current (uA) 0.0002@±5V
Minimum CMRR (dB) 70
Maximum Supply Voltage Range (V) 30 to 32
Minimum CMRR Range (dB) 70 to 71
Typical Voltage Gain (dB) 81.58
Typical Slew Rate (V/us) 1.2@±5V
Typical Output Current (mA) 40(Max)
Typical Input Noise Voltage Density (nV/rtHz) 49@±5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.003@±5V
Shut Down Support No
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Power Supply Type Dual



PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet



MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R



PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet



ECAD MODELS

Продукт RFQ