
|
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• High slew rate: 20 V/μs (TL08xH, typ)
|
• Low offset voltage: 1 mV (TL08xH, typ)
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• Low offset voltage drift: 2 μV/°C
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• Low power consumption: 940 μA/ch (TL08xH, typ) |
• Wide common-mode and differential
voltage ranges
– Common-mode input voltage range
includes VCC+ |
• Low input bias and offset currents |
• Low noise:
Vn = 18 nV/√Hz (typ) at f = 1 kHz
|
• Output short-circuit protection
|
• Low total harmonic distortion: 0.003% (typ) |
• Wide supply voltage:
±2.25 V to ±20 V, 4.5 V to 40 V |
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CATALOG |
TL082CP COUNTRY OF ORIGIN |
TL082CP PARAMETRIC INFO
|
TL082CP PACKAGE INFO
|
TL082CP MANUFACTURING INFO
|
TL082CP PACKAGING INFO
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TL082CP ECAD MODELS
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TL082CP APPLICATIONS
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COUNTRY OF ORIGIN |
Taiwan (Province of China) |
Mexico |
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PARAMETRIC INFO
|
Manufacturer Type |
General Purpose Amplifier |
Type |
General Purpose Amplifier |
Minimum Single Supply Voltage (V) |
4.5 |
Number of Channels per Chip |
2 |
Typical Single Supply Voltage (V) |
5|9|12|15|18|24|28 |
Maximum Single Supply Voltage (V) |
40 |
Maximum Quiescent Current (mA) |
5.6@±15V |
Minimum Dual Supply Voltage (V) |
±2.25 |
Typical Gain Bandwidth Product (MHz) |
3 |
Maximum Input Offset Voltage (mV) |
15@±15V |
Typical Dual Supply Voltage (V) |
±3|±5|±9|±12|±15|±18 |
Maximum Input Offset Current (uA) |
0.0002@±15V |
Maximum Dual Supply Voltage (V) |
±20 |
Maximum Operating Supply Voltage (V) |
±20|40 |
Maximum Input Bias Current (uA) |
0.0004@±15V |
Minimum CMRR (dB) |
70 |
Maximum Supply Voltage Range (V) |
37 to 44 |
Minimum CMRR Range (dB) |
70 to 71 |
Typical Voltage Gain (dB) |
106.02 |
Typical Slew Rate (V/us) |
13@±15V |
Typical Input Noise Voltage Density (nV/rtHz) |
18@±15V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.01@±15V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
0 |
Maximum Operating Temperature (°C) |
70 |
Power Supply Type |
Single|Dual |
|
|
PACKAGE INFO
|
Supplier Package |
PDIP |
Basic Package Type |
Through Hole |
Pin Count |
8 |
Lead Shape |
Through Hole |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
2.54 |
Package Length (mm) |
10.16(Max) |
Package Width (mm) |
6.6(Max) |
Package Height (mm) |
5.08(Max) - 0.51(Min) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
10.16(Max) |
Package Overall Width (mm) |
10.92(Max) |
Package Overall Height (mm) |
5.08(Max) |
Seated Plane Height (mm) |
5.08(Max) |
Mounting |
Through Hole |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Plastic Dual In Line Package |
Package Family Name |
DIP |
Jedec |
MS-001BA |
Package Outline |
Link to Datasheet |
|
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MANUFACTURING INFO
|
MSL |
N/R |
Maximum Reflow Temperature (°C) |
N/R |
Reflow Solder Time (Sec) |
N/R |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/A |
Wave Solder Time (Sec) |
N/A |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
Packaging |
Tube |
Quantity Of Packaging |
50 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Solar energy: string and central inverter
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• Motor drives: AC and servo drive control and
power stage modules
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• Single phase online UPS
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• Three phase UPS
|
• Pro audio mixers |
• Battery test equipment |
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