TL082CP Texas Instruments TL08xx FET-Input Operational Amplifiers

label:
2024/01/25 252



• High slew rate: 20 V/μs (TL08xH, typ)
• Low offset voltage: 1 mV (TL08xH, typ)
• Low offset voltage drift: 2 μV/°C
• Low power consumption: 940 μA/ch (TL08xH, typ)
• Wide common-mode and differential voltage ranges – Common-mode input voltage range includes VCC+
• Low input bias and offset currents
• Low noise: Vn = 18 nV/√Hz (typ) at f = 1 kHz
• Output short-circuit protection
• Low total harmonic distortion: 0.003% (typ)
• Wide supply voltage: ±2.25 V to ±20 V, 4.5 V to 40 V


CATALOG
TL082CP COUNTRY OF ORIGIN
TL082CP PARAMETRIC INFO
TL082CP PACKAGE INFO
TL082CP MANUFACTURING INFO
TL082CP PACKAGING INFO
TL082CP ECAD MODELS
TL082CP APPLICATIONS


COUNTRY OF ORIGIN
Taiwan (Province of China)
Mexico


PARAMETRIC INFO
Manufacturer Type General Purpose Amplifier
Type General Purpose Amplifier
Minimum Single Supply Voltage (V) 4.5
Number of Channels per Chip 2
Typical Single Supply Voltage (V) 5|9|12|15|18|24|28
Maximum Single Supply Voltage (V) 40
Maximum Quiescent Current (mA) 5.6@±15V
Minimum Dual Supply Voltage (V) ±2.25
Typical Gain Bandwidth Product (MHz) 3
Maximum Input Offset Voltage (mV) 15@±15V
Typical Dual Supply Voltage (V) ±3|±5|±9|±12|±15|±18
Maximum Input Offset Current (uA) 0.0002@±15V
Maximum Dual Supply Voltage (V) ±20
Maximum Operating Supply Voltage (V) ±20|40
Maximum Input Bias Current (uA) 0.0004@±15V
Minimum CMRR (dB) 70
Maximum Supply Voltage Range (V) 37 to 44
Minimum CMRR Range (dB) 70 to 71
Typical Voltage Gain (dB) 106.02
Typical Slew Rate (V/us) 13@±15V
Typical Input Noise Voltage Density (nV/rtHz) 18@±15V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.01@±15V
Shut Down Support No
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 70
Power Supply Type Single|Dual


PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 8
Lead Shape Through Hole
PCB 8
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 10.16(Max)
Package Width (mm) 6.6(Max)
Package Height (mm) 5.08(Max) - 0.51(Min)
Package Diameter (mm) N/R
Package Overall Length (mm) 10.16(Max)
Package Overall Width (mm) 10.92(Max)
Package Overall Height (mm) 5.08(Max)
Seated Plane Height (mm) 5.08(Max)
Mounting Through Hole
Package Weight (g) N/A
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Jedec MS-001BA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/R
Reflow Solder Time (Sec) N/R
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/A
Wave Solder Time (Sec) N/A
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 50
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• Solar energy: string and central inverter
• Motor drives: AC and servo drive control and power stage modules
• Single phase online UPS
• Three phase UPS
• Pro audio mixers
• Battery test equipment

Продукт RFQ