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• 120-mA Maximum Output Current
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• 17-V Maximum Output Voltage
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• 25-MHz Internal Oscillator Requires No External Components
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• Internal Power-On Reset
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• Noise Filter on SCL/SDA Inputs
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• 1 No Glitch on Power Up
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• Active-Low Reset
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• Supports Hot Insertion
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• Low Standby Current
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• 3.3-V or 5-V Supply Voltage
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| CATALOG |
TLC59116FIRHBR COUNTRY OF ORIGIN
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TLC59116FIRHBR PARAMETRIC INFO
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TLC59116FIRHBR PACKAGE INFO
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TLC59116FIRHBR MANUFACTURING INFO
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TLC59116FIRHBR PACKAGING INFO
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TLC59116FIRHBR ECAD MODELS
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TLC59116FIRHBR APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Philippines
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Thailand
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Malaysia
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PARAMETRIC INFO
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| Number of Segments |
16 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Current (uA) |
13000 |
| Maximum Power Dissipation (mW) |
1600 |
| Low Level Output Current (uA) |
30000(Min) |
| Output Voltage (V) |
17(Max) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Operating Supply Voltage (V) |
3 to 5.5 |
| Maximum Output Current (mA) |
120 |
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| PACKAGE INFO |
| Supplier Package |
VQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
No Lead |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
5.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
5.1(Max) |
| Package Overall Height (mm) |
1(Max) |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package Family Name |
QFN |
| Jedec |
MO-220 |
| Package Outline |
Link to Datasheet |
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| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • Gaming |
| • Small Signage |
| • Industrial Equipment |
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