 |
|
| • 16 Constant-Current Output Channels |
| • Output Current Adjusted By External Resistor |
| • Constant Output Current Range: 5 mA to 120 mA |
• Constant Output Current Invariant to Load Voltage Change
|
| • Open-Load and Shorted-Load Detection |
| • 256-Step Programmable Global Current Gain |
• Excellent Output Current Accuracy:
– Between Channels: < ±6% (Max),10 mA to 50 mA
– Between ICs: < ±6% (Max), 10 mA to 50 mA |
| • 30-MHz Maximum Clock Frequency |
| • Schmitt-Trigger Input |
| • 3.3-V or 5-V Supply Voltage |
| • Thermal Shutdown for Overtemperature Protection |
|
| CATALOG |
| TLC5926IPWPR COUNTRY OF ORIGIN |
| TLC5926IPWPR PARAMETRIC INFO |
| TLC5926IPWPR PACKAGE INFO |
| TLC5926IPWPR MANUFACTURING INFO |
| TLC5926IPWPR PACKAGING INFO |
| TLC5926IPWPR ECAD MODELS |
| TLC5926IPWPR FUNCTIONAL BLOCK DIAGRAM |
| TLC5926IPWPR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
| Philippines |
|
| PARAMETRIC INFO |
| Number of Segments |
16 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Current (uA) |
20000 |
| Maximum Power Dissipation (mW) |
2900 |
| Low Level Output Current (uA) |
1000 |
| High Level Output Current (uA) |
-1000 |
| Output Voltage (V) |
-0.5 to 20 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Operating Supply Voltage (V) |
3 to 5.5 |
|
| PACKAGE INFO |
| Supplier Package |
HTSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
Gull-wing |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
7.9(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
7.9(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SOP |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Packaging Document |
Link to Datasheet |
|
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • General LED Lighting Applications |
| • LED Display Systems |
| • LED Signage
|
| • Automotive LED Lighting |
| • White Goods |
|
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