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• Power-On Reset Generator
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• Automatic Reset Generation After Voltage Drop
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• Temperature-Compensated Voltage Reference
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| • Programmable Delay Time by External Capacitor |
| • Supply Voltage Range . . . 2 V to 6 V |
| • Defined RESET Output from VDD ≥ 1 V |
| • Power-Down Control Support for Static RAM With Battery Backup |
| • Maximum Supply Current of 16 µA |
| • Power Saving Totem-Pole Outputs |
| • Temperature Range . . . Up to –55°C to 125°C |
| |
| CATALOG |
| TLC7733IDR COUNTRY OF ORIGIN |
TLC7733IDR PARAMETRIC INFO
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TLC7733IDR PACKAGE INFO
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TLC7733IDR MANUFACTURING INFO
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TLC7733IDR PACKAGING INFO
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TLC7733IDR EACD MODELS
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| TLC7733IDR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
| Taiwan (Province of China) |
|
PARAMETRIC INFO
|
| Output Driver |
Active Low |
| Manual Reset |
No |
| Watchdog Timer |
No |
| Number of Supervisors |
1 |
| Typical Reset Threshold Voltage (V) |
2.93 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Chip Enable Signals |
No |
| Power Fail Detection |
Yes |
| Battery Backup Switching |
Yes |
| Maximum Reset Active Time (ms) |
4.2 |
| Maximum Operating Supply Voltage (V) |
6 |
| Minimum Reset Threshold Voltage (V) |
2.86 |
| Maximum Reset Threshold Voltage (V) |
3 |
| Maximum Power Dissipation (mW) |
725 |
| Maximum Supply Current (uA) |
16 |
| Minimum Operating Supply Voltage (V) |
2 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Type |
Voltage Supervisory |
| Programmability |
Yes |
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PACKAGE INFO
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| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Medical Imaging
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