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• 1/2 VI Virtual Ground for Analog Systems
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• Self-Contained 3-terminal TO-226AA Package
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• Micropower Operation . . . 170 µA Typ,VI= 5 V
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| • Wide VI Range . . . 4 V to 40 V |
| • High Output-Current Capability− Source . . . 20 mA Typ− Sink . . . 20 mA Typ |
| • Excellent Output Regulation− −45 µV Typ at IO = 0 to −10 mA− +15 µV Typ at IO = 0 to +10 mA |
| • Low-Impedance Output . . . 0.0075 Ω Typ |
| • Noise Reduction Pin (D, JG, and P Packages Only) |
| • 5-V Regulator capable of 10-mA load |
| CATALOG |
| TLE2426CDR COUNTRY OF ORIGIN |
TLE2426CDR PARAMETRIC INFO
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TLE2426CDR PACKAGE INFO
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TLE2426CDR MANUFACTURING INFO
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TLE2426CDR PACKAGING INFO
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TLE2426CDR EACD MODELS
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| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
|
PARAMETRIC INFO
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| Topology |
Series |
| Reference Type |
Adjustable |
| Output Voltage (V) |
2 to 20 |
| Minimum Operating Temperature (°C) |
0 |
| Maximum Operating Temperature (°C) |
70 |
| Maximum Input Voltage (V) |
40 |
| Maximum Output Current (mA) |
20(Typ) |
| Maximum Temperature Coefficient |
35ppm/°C(Typ) |
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PACKAGE INFO
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| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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|
PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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