TLE42664G Infineon Technologies IC REG LINEAR 5V 100MA SOT223-4

label:
2023/12/4 392


• Output Voltage 5 V ± 2 % up to Output Currents of 50 mA
• Output Voltage 5 V ± 3 % up to Output Currents 100 mA
• Very Low Dropout Voltage
• Very Low Current Consumption: typ. 40 µA
• Enable Input
• Output Current Limitation
• Reverse Polarity Protection
• Overtemperature Shutdown
• Wide Temperature Range From -40 °C up to 150 °C
• Suitable for Use in Automotive Electronics
• Green Product (RoHS compliant)
• AEC Qualified


CATALOG
TLE42664G COUNTRY OF ORIGIN
TLE42664G LIFECYCLE
TLE42664G PARAMETRIC INFO
TLE42664G PACKAGE INFO
TLE42664G MANUFACTURING INFO
TLE42664G PACKAGING INFO
TLE42664G FUNCTIONAL BLOCK DIAGRAM  


COUNTRY OF ORIGIN
Malaysia


LIFECYCLE
Unconfirmed


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 0.1
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 150
Output Voltage Range (V) 1.8 to 10
Output Type Fixed
Junction to Ambient 139K/W(Typ)
Junction to Case 17K/W(Typ)
Polarity Positive
Special Features Current Limit|Reverse Polarity Protection|Thermal Shutdown Protection
Load Regulation 90mV
Line Regulation 30mV
Maximum Quiescent Current (mA) 0.07
Maximum Dropout Voltage @ Current (V) 0.5@100mA
Minimum Input Voltage (V) 5.5
Maximum Input Voltage (V) 40
Output Voltage (V) 5
Typical Quiescent Current (mA) 0.04
Typical Dropout Voltage @ Current (V) 0.25@100mA
Accuracy (%) ±3
Minimum Storage Temperature (°C) -50
Maximum Storage Temperature (°C) 150
 
PACKAGE INFO
Supplier Package SOT-223
Basic Package Type Lead-Frame SMT
Pin Count 4
Lead Shape Gull-wing
PCB 3
Tab Tab
Pin Pitch (mm) 2.3
Package Length (mm) 6.5
Package Width (mm) 3.5
Package Height (mm) 1.6
Package Diameter (mm) N/R
Package Overall Length (mm) 6.5
Package Overall Width (mm) 7
Package Overall Height (mm) 1.8(Max)
Seated Plane Height (mm) 1.8(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec TO-261AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 4000
Packaging Document Link to Datasheet
 
FUNCTIONAL BLOCK DIAGRAM


Продукт RFQ