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• Output voltage options: 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V, and adjustable
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• Output current: 800 mA
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• Specified dropout voltage at multiple current levels
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• Line regulation maximum: 0.2%
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• Load regulation maximum: 0.4% |
• For drop-in replacements in fixed output SOT-223 package configuration and improved functionality, see the TLV761 |
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CATALOG |
TLV1117-33IDCYR COUNTRY OF ORIGIN |
TLV1117-33IDCYR PARAMETRIC INFO
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TLV1117-33IDCYR PACKAGE INFO
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TLV1117-33IDCYR MANUFACTURING INFO
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TLV1117-33IDCYR PACKAGING INFO
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TLV1117-33IDCYR EACD MODELS
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TLV1117-33IDCYR APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
China Hong Kong |
Malaysia |
Thailand |
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PARAMETRIC INFO
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type |
LDO |
Number of Outputs |
1 |
Maximum Output Current (A) |
0.8 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Output Type |
Fixed |
Output Voltage Range (V) |
1.8 to 10 |
Junction to ambient |
104.3°C/W |
Junction to Case |
53.7°C/W |
Polarity |
Positive |
Special Features |
Current Limit|Thermal Protection |
Load Regulation |
0.4% |
Line Regulation |
0.2% |
Maximum Quiescent Current (mA) |
15 |
Maximum Dropout Voltage @ Current (V) |
1.2@100mA|1.25@500mA|1.3@800mA |
Minimum Input Voltage (V) |
4.7 |
Maximum Input Voltage (V) |
15 |
Output Voltage (V) |
3.3 |
Typical Quiescent Current (mA) |
5 |
Typical Dropout Voltage @ Current (V) |
1.1@100mA|1.15@500mA|1.2@800mA |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Typical PSRR (dB) |
75 |
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PACKAGE INFO
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Supplier packaging |
SOT-223 |
Basic package type |
Lead-Frame SMT |
Number of pins |
4 |
Pin shape |
Gull-wing |
PCB |
3 |
ears |
ears |
Pin spacing (mm) |
2.3 |
Package length (mm) |
6.7(Max) |
Package width (mm) |
3.7(Max) |
Package height (mm) |
1.7(Max) |
Package diameter (mm) |
N/R |
Mounting surface height (mm) |
1.8(Max) |
Install |
Surface Mount |
Package weight (g) |
not applicable |
Packaging materials |
Plastic |
package instruction |
Small Outline Transistor |
Package series name |
SOT |
JEDEC |
TO-261AA |
Package outline |
Link to datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Maximum reflow temperature (°C) |
260 |
Reflow soldering time (seconds) |
30 |
Number of reflow cycles |
3 |
standard |
J-STD-020D |
Reflow temperature source |
Link to datasheet |
Maximum wave soldering temperature (°C) |
N/R |
Wave soldering time (seconds) |
N/R |
Lead Finish(Plating) |
Matt Sn |
Plating materials |
not applicable |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R |
Package |
Tape and reel packaging |
Packing quantity |
2500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q3 |
packaging type file |
Link to datasheet |
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ECAD MODELS
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APPLICATIONS |
• Electronic points of sale |
• Medical, health, and fitness applications |
• Printers |
• Appliances and white goods |
• TV set-top boxes |
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