TLV1117-33IDCYR Texas Instruments TLV1117 Adjustable and Fixed Low-Dropout Voltage Regulator

label:
2024/03/25 254



• Output voltage options: 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V, and adjustable
• Output current: 800 mA
• Specified dropout voltage at multiple current levels
• Line regulation maximum: 0.2%
• Load regulation maximum: 0.4%
• For drop-in replacements in fixed output SOT-223 package configuration and improved functionality, see the TLV761


CATALOG
TLV1117-33IDCYR COUNTRY OF ORIGIN
TLV1117-33IDCYR PARAMETRIC INFO
TLV1117-33IDCYR PACKAGE INFO
TLV1117-33IDCYR MANUFACTURING INFO
TLV1117-33IDCYR PACKAGING INFO
TLV1117-33IDCYR EACD MODELS
TLV1117-33IDCYR APPLICATIONS


COUNTRY OF ORIGIN
China
China Hong Kong
Malaysia
Thailand


PARAMETRIC INFO
type LDO
Number of Outputs 1
Maximum Output Current (A) 0.8
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Fixed
Output Voltage Range (V) 1.8 to 10
Junction to ambient 104.3°C/W
Junction to Case 53.7°C/W
Polarity Positive
Special Features Current Limit|Thermal Protection
Load Regulation 0.4%
Line Regulation 0.2%
Maximum Quiescent Current (mA) 15
Maximum Dropout Voltage @ Current (V) 1.2@100mA|1.25@500mA|1.3@800mA
Minimum Input Voltage (V) 4.7
Maximum Input Voltage (V) 15
Output Voltage (V) 3.3
Typical Quiescent Current (mA) 5
Typical Dropout Voltage @ Current (V) 1.1@100mA|1.15@500mA|1.2@800mA
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical PSRR (dB) 75


PACKAGE INFO
Supplier packaging SOT-223
Basic package type Lead-Frame SMT
Number of pins 4
Pin shape Gull-wing
PCB 3
ears ears
Pin spacing (mm) 2.3
Package length (mm) 6.7(Max)
Package width (mm) 3.7(Max)
Package height (mm) 1.7(Max)
Package diameter (mm) N/R
Mounting surface height (mm) 1.8(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Small Outline Transistor
Package series name SOT
JEDEC TO-261AA
Package outline Link to datasheet


MANUFACTURING INFO
MSL 2
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
standard J-STD-020D
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Matt Sn
Plating materials not applicable
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Package Tape and reel packaging
Packing quantity 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q3
packaging type file Link to datasheet


ECAD MODELS



APPLICATIONS
• Electronic points of sale
• Medical, health, and fitness applications
• Printers
• Appliances and white goods
• TV set-top boxes
Продукт RFQ