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• Qualified for Automotive Applications
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• AEC Q100-Qualified With the Following Results– Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature– Device HBM ESD Classification Level 2(TLV1701-Q1)– Device HBM ESD Classification Level 1C(TLV1702-Q1,TLV1704-Q1)– Device CDM ESD Classification Level C6
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• Supply Range: 2.2 V to 36 V or ±1.1 V to ±18 V
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• Low Quiescent Current: 55 µA per Comparator
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• Input Common-Mode Range Includes Both Rails
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• Low Propagation Delay: 560 ns
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• Low Input Offset Voltage: 300 µV
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• Open Collector Outputs:– Up to 36 V Above Negative Supply Regardless of Supply Voltage
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• Industrial Temperature Range: –40°C to +125°C
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• Small Packages:– Single: SOT23-5 and SC-70-5– Dual: VSSOP-8– Quad: TSSOP-14
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| CATALOG |
TLV1704AQPWRQ1 COUNTRY OF ORIGIN
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TLV1704AQPWRQ1 PARAMETRIC INFO
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TLV1704AQPWRQ1 PACKAGE INFO
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TLV1704AQPWRQ1 MANUFACTURING INFO
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TLV1704AQPWRQ1 PACKAGING INFO
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TLV1704AQPWRQ1 ECAD MODELS
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TLV1704AQPWRQ1 APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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PARAMETRIC INFO
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| Rail to Rail |
Rail to Rail Input |
| Manufacturer Type |
Micropower Comparator |
| Process Technology |
Bipolar |
| Number of Channels per Chip |
4 |
| Typical PSRR (dB) |
96.48 |
| Output Type |
Open Collector |
| Maximum Input Offset Voltage (mV) |
2.5@36V |
| Maximum Input Bias Current (uA) |
0.015@36V |
| Strobe Capability |
No |
| Maximum Propagation Delay Time (ns) |
560(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single|Dual |
| Maximum Operating Supply Voltage (V) |
±18|36 |
| Integrated Voltage Reference |
No |
| Minimum Single Supply Voltage (V) |
2.2 |
| Integrated OP Amp |
No |
| Typical Single Supply Voltage (V) |
3|5|9|12|15|18|24|28 |
| Maximum Single Supply Voltage (V) |
36 |
| Minimum Dual Supply Voltage (V) |
±1.1 |
| Typical Dual Supply Voltage (V) |
±3|±5|±9|±12|±15 |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Quiescent Current (mA) |
0.3@36V |
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PACKAGE INFO
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| Supplier Package |
TSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
14 |
| Lead Shape |
Gull-wing |
| PCB |
14 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-153AB-1 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Overvoltage and Undervoltage Detectors |
| • Window Comparators |
| • Overcurrent Detectors |
| • Zero-Crossing Detectors |
| • System Monitoring for:– White Goods– Automotive– Medical |
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