TLV2452IDGKR Texas Instruments IC OPAMP GP 220KHZ RRO 8VSSOP

label:
2025/05/7 4
TLV2452IDGKR Texas Instruments IC OPAMP GP 220KHZ RRO 8VSSOP


CATALOG
TLV2452IDGKR COUNTRY OF ORIGIN
TLV2452IDGKR PARAMETRIC INFO
TLV2452IDGKR PACKAGE INFO
TLV2452IDGKR MANUFACTURING INFO
TLV2452IDGKR PACKAGING INFO
TLV2452IDGKR ECAD MODELS


COUNTRY OF ORIGIN
China
Thailand
Malaysia


PARAMETRIC INFO
Manufacturer Type Low Power Amplifier
Type Low Power Amplifier
Rail to Rail Rail to Rail Input/Output
Number of Channels per Chip 2
Minimum Single Supply Voltage (V) 2.7
Minimum PSRR (dB) 48
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 6
Typical Gain Bandwidth Product (MHz) 0.22
Minimum Dual Supply Voltage (V) ±1.35
Maximum Quiescent Current (mA) 0.084@5V
Maximum Input Offset Voltage (mV) 1.5@±2.5V
Maximum Dual Supply Voltage (V) ±3
Maximum Input Offset Current (uA) 0.0045@±2.5V
Maximum Input Bias Current (uA) 0.005@±2.5V
Maximum Operating Supply Voltage (V) ±3|6
Maximum Supply Voltage Range (V) 6 to 9
Minimum CMRR (dB) 70
Minimum CMRR Range (dB) 70 to 71
Typical Voltage Gain (dB) 103
Typical Slew Rate (V/us) 0.11@5V
Typical Settling Time (ns) 30000
Typical Output Current (mA) 10@5V
Typical Input Noise Voltage Density (nV/rtHz) 52@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 3.5@5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended Industrial
Power Supply Type Single|Dual
Maximum Power Dissipation (mW) 481


PACKAGE INFO
Supplier Package VSSOP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3.1(Max)
Package Width (mm) 3.1(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3.1(Max)
Package Overall Width (mm) 5.05(Max)
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Shrink Small Outline Package
Package Family Name SO
Jedec MO-187
Package Outline Link to Datasheet
Maximum PACKAGE_DIMENSION_H 0.95
Minimum PACKAGE_DIMENSION_H N/A
Maximum PACKAGE_DIMENSION_L 3.1
Minimum PACKAGE_DIMENSION_L 2.9
Maximum PACKAGE_DIMENSION_W 3.1
Minimum PACKAGE_DIMENSION_W 2.9
Maximum Diameter N/R
Minimum Diameter N/R
Maximum Seated_Plane_Height 1.1
Minimum Seated_Plane_Height N/A


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au|AuAg
Under Plating Material Pd over Ni
Terminal Base Material Cu


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
 

ECAD MODELS


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