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• Low Propagation Delay: 40ns
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• Low Quiescent Current:40µA per Channel
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• Input Common-Mode Range Extends 200mV Beyond Either Rail
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• Low Input Offset Voltage: 1mV
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• Push-Pull Outputs
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• Supply Range: 2.7V to 5.5V
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• Industrial Temperature Range:–40°C to 125°C
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• Small Packages:5-Pin SC70, 5-Pin SOT-23, 8-Pin SOIC, 8-Pin VSSOP
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|
| CATALOG |
TLV3201AIDCKT COUNTRY OF ORIGIN
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TLV3201AIDCKT PARAMETRIC INFO
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TLV3201AIDCKT PACKAGE INFO
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TLV3201AIDCKT MANUFACTURING INFO
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TLV3201AIDCKT PACKAGING INFO
|
TLV3201AIDCKT ECAD MODELS
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TLV3201AIDCKT APPLICATIONS
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|
COUNTRY OF ORIGIN
|
China
|
|
PARAMETRIC INFO
|
| Rail to Rail |
Rail to Rail Input |
| Manufacturer Type |
Micropower Comparator |
| Typical PSRR (dB) |
85 |
| Number of Channels per Chip |
1 |
| Output Type |
Push-Pull |
| Maximum Input Offset Voltage (mV) |
5@5V |
| Maximum Input Bias Current (uA) |
0.00005@5V |
| Typical CMRR (dB) |
70 |
| Strobe Capability |
No |
| Maximum Propagation Delay Time (ns) |
50 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single |
| Integrated Voltage Reference |
No |
| Maximum Test Temperature (°C) |
125 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Integrated OP Amp |
No |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Quiescent Current (mA) |
0.05@5V |
|
|
PACKAGE INFO
|
| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.15(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.15(Max) |
| Package Overall Width (mm) |
2.4(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-203 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
2.15 |
| Minimum PACKAGE_DIMENSION_L |
1.85 |
| Maximum PACKAGE_DIMENSION_W |
1.4 |
| Minimum PACKAGE_DIMENSION_W |
1.1 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
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| ECAD MODELS |
|
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| APPLICATIONS |
• Inspection Equipment
|
• Test and Measurement
|
• High-Speed Sampling Systems
|
• Telecom
|
• Portable Communications
|
|
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