|
|
• Low Propagation Delay: 40 ns
|
• Low Quiescent Current:
40 µA per Channel
|
• Input Common-Mode Range Extends 200 mV
Beyond Either Rail
|
• Low Input Offset Voltage: 1 mV
|
• Push-Pull Outputs
|
| • Supply Range: 2.7 V to 5.5 V |
| • Industrial Temperature Range:
–40°C to 125°C |
| • Small Packages:
5-Pin SC70, 5-Pin SOT-23, 8-Pin SOIC, 8-Pin
VSSOP |
|
| CATALOG |
TLV3202AIDGKR COUNTRY OF ORIGIN
|
TLV3202AIDGKR PARAMETRIC INFO
|
TLV3202AIDGKR PACKAGE INFO
|
TLV3202AIDGKR MANUFACTURING INFO
|
TLV3202AIDGKR PACKAGING INFO
|
TLV3202AIDGKR ECAD MODELS
|
TLV3202AIDGKR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
| Malaysia |
| Germany |
|
PARAMETRIC INFO
|
| Rail to Rail |
Rail to Rail Input |
| Manufacturer Type |
Micropower Comparator |
| Number of Channels per Chip |
2 |
| Typical PSRR (dB) |
85 |
| Output Type |
Push-Pull |
| Maximum Input Offset Voltage (mV) |
5@5V |
| Maximum Input Bias Current (uA) |
0.00005@5V |
| Typical CMRR (dB) |
70 |
| Strobe Capability |
No |
| Maximum Propagation Delay Time (ns) |
50 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Supplier Temperature Grade |
Industrial |
| Power Supply Type |
Single |
| Integrated Voltage Reference |
No |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Integrated OP Amp |
No |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
3|5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Quiescent Current (mA) |
0.05@5V |
|
|
PACKAGE INFO
|
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
PdNiAg |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Inspection Equipment
|
| • Test and Measurement |
• High-Speed Sampling Systems
|
• Telecom
|
| • Portable Communications |
| |
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