|
| |
• High Speed: 4.5 ns
|
• Rail-to-Rail I/O
|
• Supply Voltage: 2.7 V to 5.5 V
|
| • Push-Pull CMOS Output Stage |
| • Shutdown (TLV3501 Only) |
| • Micro Packages: 6-Pin SOT-23 (Single), 8-Pin SOT-23 (Dual) |
| • Low Supply Current: 3.2 mA |
| |
| CATALOG |
| TLV3501AIDBVT COUNTRY OF ORIGIN |
TLV3501AIDBVT PARAMETRIC INFO
|
TLV3501AIDBVT PACKAGE INFO
|
TLV3501AIDBVT MANUFACTURING INFO
|
TLV3501AIDBVT PACKAGING INFO
|
TLV3501AIDBVT EACD MODELS
|
| TLV3501AIDBVT APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Philippines |
|
PARAMETRIC INFO
|
| Rail to Rail |
Rail to Rail Input/Output |
| Manufacturer Type |
High Speed Comparator |
| Typical PSRR (dB) |
80 |
| Number of Channels per Chip |
1 |
| Output Type |
Push-Pull |
| Maximum Input Offset Voltage (mV) |
6.5@5.5V |
| Maximum Input Bias Current (uA) |
0.00001@5.5V |
| Typical CMRR (dB) |
70 |
| Strobe Capability |
No |
| Typical Input Offset Current (uA) |
0.000002@5.5V |
| Maximum Input Offset Current (uA) |
0.00001@5.5V |
| Maximum Propagation Delay Time (ns) |
10 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Integrated Voltage Reference |
No |
| Maximum Test Temperature (°C) |
125 |
| Minimum Test Temperature (°C) |
-40 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Integrated OP Amp |
No |
| Minimum Single Supply Voltage (V) |
2.2 |
| Typical Single Supply Voltage (V) |
2.7 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Quiescent Current (mA) |
5@5V |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3(Max) |
| Package Overall Height (mm) |
1.45(Max) |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
9 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Automatic Test Equipment |
| • Wireless Base Stations |
| • Threshold Detectors |
| • Zero-Crossing Detectors |
| • Window Comparators |
|
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