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• Low-voltage operation, VREF = 1.24V
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• Adjustable output voltage, VO = VREF to 6V
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• Reference voltage tolerances at 25°C– 0.5% for TLV431B– 1% for TLV431A– 1.5% for TLV431
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• Typical temperature drift– 4mV (0°C to 70°C)– 6mV (–40°C to 85°C)– 11mV (–40°C to 125°C)
|
• Low operational cathode current, 80µA typical |
• 0.25Ω typical output impedance |
• Ultra-small SC-70 package offers 40% smaller footprint than SOT-23-3 |
• See TLVH431 and TLVH432 for:– Wider VKA (1.24V to 18 V) and IK (80mA)– Additional SOT-89 package– Multiple pinouts for SOT-23-3 and SOT-89
packages |
• On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. on all other products, production processing does not
necessarily include testing of all parameters. |
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CATALOG |
TLV431AIDBVR COUNTRY OF ORIGIN |
TLV431AIDBVR PARAMETRIC INFO
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TLV431AIDBVR PACKAGE INFO
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TLV431AIDBVR MANUFACTURING INFO
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TLV431AIDBVR PACKAGING INFO
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TLV431AIDBVR EACD MODELS
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TLV431AIDBVR APPLICATIONS |
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COUNTRY OF ORIGIN |
Philippines |
Malaysia |
Thailand |
China |
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PARAMETRIC INFO
|
Topology |
Shunt |
Reference Type |
Adjustable |
Output Voltage (V) |
1.24 to 6 |
Initial Accuracy |
1% |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Maximum Storage Temperature (°C) |
150 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Input Voltage (V) |
7 |
Maximum Output Current (mA) |
15 |
Maximum Temperature Coefficient |
138ppm/°C |
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PACKAGE INFO
|
Supplier Package |
SOT-23 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
5 |
Lead Shape |
Gull-wing |
PCB |
5 |
Tab |
N/R |
Pin Pitch (mm) |
0.95 |
Package Length (mm) |
3.05(Max) |
Package Width (mm) |
1.75(Max) |
Package Height (mm) |
1.1 |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.05(Max) |
Package Overall Width (mm) |
3(Max) |
Package Overall Height (mm) |
1.45(Max) |
Seated Plane Height (mm) |
1.45(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
MO-178AA |
Package Outline |
Link to Datasheet |
|
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MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn|Au |
Under Plating Material |
N/A|Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
|
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PACKAGING INFO
|
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Reel Diameter (in) |
7 |
Tape Pitch (mm) |
4 |
Tape Width (mm) |
8 |
Component Orientation |
Q3 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
|

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APPLICATIONS |
• Adjustable voltage and current referencing |
• Secondary side regulation in flyback SMPSs |
• Zener replacement |
• Voltage monitoring |
• Comparator with integrated reference
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