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• DCS-Control™ Topology
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• Up to 95% Efficiency
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• 17-μA Operating Quiescent Current
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• 31mΩ and 23mΩ Power MOSFET Switch
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• 2.5-V to 6.0-V Input Voltage Range
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• 0.8-V to VIN Adjustable Output Voltage
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• Power Save Mode for Light Load Efficiency
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• 100% Duty Cycle for Lowest Dropout
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• Hiccup Short-Circuit Protection
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• Output Discharge
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• Power Good Output
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• Thermal Shutdown Protection
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• Available in 2-mm × 2-mm VSON Package
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• For Improved Feature Set, See TPS62085
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• Create a Custom Design using the TLV62085 with the WEBENCH® Power Designer
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| CATALOG |
TLV62085RLTR COUNTRY OF ORIGIN
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TLV62085RLTR PARAMETRIC INFO
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TLV62085RLTR PACKAGE INFO
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TLV62085RLTR MANUFACTURING INFO
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TLV62085RLTR PACKAGING INFO
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TLV62085RLTR ECAD MODELS
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TLV62085RLTR APPLICATIONS
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COUNTRY OF ORIGIN
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Philippines
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China
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PARAMETRIC INFO
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| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
2.6 |
| Maximum Input Voltage (V) |
6 |
| Output Voltage (V) |
0.8 to 6 |
| Maximum Output Current (A) |
3 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Switching Frequency (kHz) |
2400 |
| Efficiency (%) |
95 |
| Switching Regulator |
Yes |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
17 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
4.6 |
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PACKAGE INFO
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| Supplier Package |
VQFN |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
7 |
| Lead Shape |
No Lead |
| PCB |
7 |
| Tab |
N/R |
| Package Length (mm) |
2.1(Max) |
| Package Width (mm) |
2.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package |
| Package Family Name |
QFN |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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| APPLICATIONS |
| • Battery-Powered Applications |
| • Point-of-Load |
| • Processor Supplies |
| • Hard Disk Drives (HDD) / Solid State Drives(SSD) |
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