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• 2% Accuracy
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• Low IQ: 31 μA
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• Available in Fixed-Output Voltages from 1.2 V to 4.8 V
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• High PSRR: 68 dB at 1 kHz
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• Stable With Effective Capacitance of 0.1 μF(1)
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• Thermal Shutdown and Overcurrent Protection
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• Available in 1.5-mm × 1.5-mm SON-6, SOT23-5,and SC-70 Packages
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| CATALOG |
TLV70018DDCR COUNTRY OF ORIGIN
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TLV70018DDCR PARAMETRIC INFO
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TLV70018DDCR PACKAGE INFO
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TLV70018DDCR MANUFACTURING INFO
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TLV70018DDCR PACKAGING INFO
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TLV70018DDCR ECAD MODELS
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TLV70018DDCR APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Thailand
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Malaysia
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Philippines
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PARAMETRIC INFO
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| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
0.2 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Regulation Condition Change In Load |
200mA |
| Regulation Condition Change In Line |
3.4V |
| Output Type |
Fixed |
| Output Voltage Range (V) |
1.8 to 10 |
| Junction to Ambient |
235.9°C/W |
| Junction to Case |
61.9°C/W |
| Polarity |
Positive |
| Special Features |
Current Limit|Thermal Shutdown Protection |
| Load Regulation |
1mV(Typ) |
| Line Regulation |
1mV(Typ) |
| Minimum Input Voltage (V) |
2 |
| Maximum Input Voltage (V) |
5.5 |
| Output Voltage (V) |
1.8 |
| Typical Quiescent Current (mA) |
0.03 |
| Typical Dropout Voltage @ Current (V) |
0.175@200mA |
| Accuracy (%) |
±2 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Ground Current @ Full Load (mA) |
0.27 |
| Typical PSRR (dB) |
68 |
| Typical Output Capacitance (uF) |
0.1 |
| Typical Output Noise Voltage (uVrms) |
48 |
| Pass Element Type |
PMOS |
| Output Capacitor Type |
Ceramic |
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|
PACKAGE INFO
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| Supplier Package |
TSOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193 |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Wireless Handsets
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• Smart Phones, PDAs
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• ZigBee® Networks
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• Bluetooth® Devices
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| • Li-Ion Operated Handheld Products |
| • WLAN and Other PC Add-on Cards |
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