
|
|
• Qualified for Automotive Applications
|
• 2% Accuracy Over Temperature
|
• Low IQ of 35 μA per Regulator
|
• Multiple Fixed-Output Voltage Combinations Possible from 1.2 V to 4.8 V
|
• High PSRR: 70 dB at 1kHz
|
• Stable With Effective Capacitance of 0.1 μF
|
|
CATALOG |
TLV7103318QDSERQ1 COUNTRY OF ORIGIN
|
TLV7103318QDSERQ1 PARAMETRIC INFO
|
TLV7103318QDSERQ1 PACKAGE INFO
|
TLV7103318QDSERQ1 MANUFACTURING INFO
|
TLV7103318QDSERQ1 PACKAGING INFO
|
TLV7103318QDSERQ1 ECAD MODELS
|
TLV7103318QDSERQ1 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Thailand
|
|
PARAMETRIC INFO
|
Type |
LDO |
Number of Outputs |
2 |
Maximum Output Current (A) |
0.2 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Output Type |
Fixed |
Output Voltage Range (V) |
1.8 to 10 |
Junction to Ambient |
190.5°C/W |
Junction to Case |
94.9°C/W |
Polarity |
Positive |
Special Features |
Current Limit|Thermal Protection |
Load Regulation |
15mV |
Line Regulation |
5mV |
Maximum Quiescent Current (mA) |
0.11 |
Maximum Dropout Voltage @ Current (V) |
0.2@200mA |
Minimum Input Voltage (V) |
2 |
Maximum Input Voltage (V) |
5.5 |
Output Voltage (V) |
1.8|3.3 |
Typical Quiescent Current (mA) |
0.07 |
Typical Dropout Voltage @ Current (V) |
0.14@200mA |
Accuracy (%) |
±2 |
Supplier Temperature Grade |
Automotive |
Typical PSRR (dB) |
80 |
Typical Output Capacitance (uF) |
0.1(Min) |
Typical Output Noise Voltage (uVrms) |
48 |
|
|
PACKAGE INFO
|
Supplier Package |
WSON |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
No Lead |
PCB |
6 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
1.55(Max) |
Package Width (mm) |
1.55(Max) |
Package Height (mm) |
0.75(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
1.55(Max) |
Package Overall Width (mm) |
1.55(Max) |
Package Overall Height (mm) |
0.8(Max) |
Seated Plane Height (mm) |
0.8(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Very Thin Small Outline No Lead Package |
Package Family Name |
SON |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
|
|
ECAD MODELS
|

|
|
APPLICATIONS |
• Automotive Applications |
• Wireless Handsets, Smart Phones, PDAs |
• MP3 Players and Other Handheld Products |
|