TLV7103318QDSERQ1 Texas Instruments Dual, 200-mA, Low-IQ Low-Dropout Regulator for Portable Devices

label:
2025/02/28 95
TLV7103318QDSERQ1 Texas Instruments Dual, 200-mA, Low-IQ Low-Dropout Regulator for Portable Devices


• Qualified for Automotive Applications
• 2% Accuracy Over Temperature
• Low IQ of 35 μA per Regulator
• Multiple Fixed-Output Voltage Combinations Possible from 1.2 V to 4.8 V
• High PSRR: 70 dB at 1kHz
• Stable With Effective Capacitance of 0.1 μF


CATALOG
TLV7103318QDSERQ1 COUNTRY OF ORIGIN
TLV7103318QDSERQ1 PARAMETRIC INFO
TLV7103318QDSERQ1 PACKAGE INFO
TLV7103318QDSERQ1 MANUFACTURING INFO
TLV7103318QDSERQ1 PACKAGING INFO
TLV7103318QDSERQ1 ECAD MODELS
TLV7103318QDSERQ1 APPLICATIONS


COUNTRY OF ORIGIN
Thailand


PARAMETRIC INFO
Type LDO
Number of Outputs 2
Maximum Output Current (A) 0.2
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Fixed
Output Voltage Range (V) 1.8 to 10
Junction to Ambient 190.5°C/W
Junction to Case 94.9°C/W
Polarity Positive
Special Features Current Limit|Thermal Protection
Load Regulation 15mV
Line Regulation 5mV
Maximum Quiescent Current (mA) 0.11
Maximum Dropout Voltage @ Current (V) 0.2@200mA
Minimum Input Voltage (V) 2
Maximum Input Voltage (V) 5.5
Output Voltage (V) 1.8|3.3
Typical Quiescent Current (mA) 0.07
Typical Dropout Voltage @ Current (V) 0.14@200mA
Accuracy (%) ±2
Supplier Temperature Grade Automotive
Typical PSRR (dB) 80
Typical Output Capacitance (uF) 0.1(Min)
Typical Output Noise Voltage (uVrms) 48


PACKAGE INFO
Supplier Package WSON
Basic Package Type Non-Lead-Frame SMT
Pin Count 6
Lead Shape No Lead
PCB 6
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 1.55(Max)
Package Width (mm) 1.55(Max)
Package Height (mm) 0.75(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 1.55(Max)
Package Overall Width (mm) 1.55(Max)
Package Overall Height (mm) 0.8(Max)
Seated Plane Height (mm) 0.8(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Very Thin Small Outline No Lead Package
Package Family Name SON
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000


ECAD MODELS



APPLICATIONS
• Automotive Applications
• Wireless Handsets, Smart Phones, PDAs
• MP3 Players and Other Handheld Products
Продукт RFQ