TLV9062IDGKR Texas Instruments TLV906xS 10-MHz, RRIO, CMOS Operational Amplifiers for Cost-Sensitive Systems

label:
2024/01/11 226



• Rail-to-rail input and output
• Low input offset voltage: ±0.3 mV
• Unity-gain bandwidth: 10 MHz
• Low broadband noise: 10 nV/√Hz
• Low input bias current: 0.5 pA
• Low quiescent current: 538 µA
• Unity-gain stable
• Internal RFI and EMI filter
• Operational at supply voltages as low as 1.8 V
• Easier to stabilize with higher capacitive load due to resistive open-loop output impedance
• Shutdown version: TLV906xS
• Extended temperature range: –40°C to 125°C  


CATALOG
TLV9062IDGKR COUNTRY OF ORIGIN
TLV9062IDGKR PARAMETRIC INFO
TLV9062IDGKR PACKAGE INFO
TLV9062IDGKR MANUFACTURING INFO
TLV9062IDGKR PACKAGING INFO
TLV9062IDGKR ECAD MODELS
TLV9062IDGKR APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
Thailand
China


PARAMETRIC INFO
Manufacturer Type General Purpose Amplifier
Type General Purpose Amplifier
Rail to Rail Rail to Rail Input/Output
Minimum Single Supply Voltage (V) 1.8
Number of Channels per Chip 2
Process Technology CMOS
Minimum PSRR (dB) 103.1(Typ)
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Output Type CMOS
Maximum Quiescent Current (mA) 1.5@5.5V
Typical Gain Bandwidth Product (MHz) 10
Maximum Input Offset Voltage (mV) 1.6@5V
Maximum Operating Supply Voltage (V) 5.5
Minimum CMRR (dB) 57
Maximum Supply Voltage Range (V) 5.5 to 6
Minimum CMRR Range (dB) 50 to 60
Typical Voltage Gain (dB) 130
Typical Slew Rate (V/us) 6.5@5V
Typical Input Offset Current (uA) 0.00000005@5.5V
Typical Settling Time (ns) 1000
Typical Input Noise Voltage Density (nV/rtHz) 16@5V
Typical Noninverting Input Current Noise Density (pA/rtHz) 0.023@5.5V
Typical Input Bias Current (uA) 0.0000005@5.5V
Shut Down Support No
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended
Power Supply Type Single


PACKAGE INFO
Supplier Package VSSOP
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 3.1(Max)
Package Width (mm) 3.1(Max)
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3.1(Max)
Package Overall Width (mm) 5.05(Max)
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Very Thin Shrink Small Outline Package
Package Family Name SO
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Lead Finish(Plating) Matte Sn|Au|AuAg
Under Plating Material N/A|Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• E-bikes
• Smoke detectors
• HVAC: heating, ventilating, and air conditioning
• Motor control: AC induction
• Refrigerators
• Wearable devices  
• Laptop computers
• Washing machines
• Sensor signal conditioning
• Power modules
• Barcode scanners
• Active filters
• Low-side current sensing  
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