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• Rail-to-rail input and output
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• Low input offset voltage: ±0.3 mV
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• Unity-gain bandwidth: 10 MHz
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• Low broadband noise: 10 nV/√Hz
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• Low input bias current: 0.5 pA
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• Low quiescent current: 538 µA
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• Unity-gain stable |
• Internal RFI and EMI filter |
• Operational at supply voltages as low as 1.8 V |
• Easier to stabilize with higher capacitive load due
to resistive open-loop output impedance |
• Shutdown version: TLV906xS |
• Extended temperature range: –40°C to 125°C
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CATALOG |
TLV9062IDGKR COUNTRY OF ORIGIN
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TLV9062IDGKR PARAMETRIC INFO
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TLV9062IDGKR PACKAGE INFO
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TLV9062IDGKR MANUFACTURING INFO
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TLV9062IDGKR PACKAGING INFO
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TLV9062IDGKR ECAD MODELS
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TLV9062IDGKR APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia |
Thailand |
China |
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PARAMETRIC INFO
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Manufacturer Type |
General Purpose Amplifier |
Type |
General Purpose Amplifier |
Rail to Rail |
Rail to Rail Input/Output |
Minimum Single Supply Voltage (V) |
1.8 |
Number of Channels per Chip |
2 |
Process Technology |
CMOS |
Minimum PSRR (dB) |
103.1(Typ) |
Typical Single Supply Voltage (V) |
3|5 |
Maximum Single Supply Voltage (V) |
5.5 |
Output Type |
CMOS |
Maximum Quiescent Current (mA) |
1.5@5.5V |
Typical Gain Bandwidth Product (MHz) |
10 |
Maximum Input Offset Voltage (mV) |
1.6@5V |
Maximum Operating Supply Voltage (V) |
5.5 |
Minimum CMRR (dB) |
57 |
Maximum Supply Voltage Range (V) |
5.5 to 6 |
Minimum CMRR Range (dB) |
50 to 60 |
Typical Voltage Gain (dB) |
130 |
Typical Slew Rate (V/us) |
6.5@5V |
Typical Input Offset Current (uA) |
0.00000005@5.5V |
Typical Settling Time (ns) |
1000 |
Typical Input Noise Voltage Density (nV/rtHz) |
16@5V |
Typical Noninverting Input Current Noise Density (pA/rtHz) |
0.023@5.5V |
Typical Input Bias Current (uA) |
0.0000005@5.5V |
Shut Down Support |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Supplier Temperature Grade |
Extended |
Power Supply Type |
Single |
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PACKAGE INFO
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Supplier Package |
VSSOP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
3.1(Max) |
Package Width (mm) |
3.1(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
3.1(Max) |
Package Overall Width (mm) |
5.05(Max) |
Package Overall Height (mm) |
1.1(Max) |
Seated Plane Height (mm) |
1.1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Thin Shrink Small Outline Package |
Package Family Name |
SO |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Lead Finish(Plating) |
Matte Sn|Au|AuAg |
Under Plating Material |
N/A|Pd over Ni |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• E-bikes
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• Smoke detectors
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• HVAC: heating, ventilating, and air conditioning
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• Motor control: AC induction
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• Refrigerators
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• Wearable devices |
• Laptop computers |
• Washing machines |
• Sensor signal conditioning |
• Power modules |
• Barcode scanners |
• Active filters |
• Low-side current sensing
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