TM4C123BH6PGEI Texas Instruments IC MCU 32BIT 256KB FLASH 144LQFP

2024/02/22 484

CATALOG

Data Bus Width (bit)	32
Series name	Tiva C
Device Core	ARM Cortex M4F
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	80
Program Memory Type	Flash
Program Memory Size	256KB
RAM Size	32KB
Maximum CPU Frequency (MHz)	80
Number of Programmable I/Os	105
Number of Timers	12
ADC Channels	24/24
ADC Resolution (bit)	12/12
Number of ADCs	Dual
Core Architecture	ARM
PWM	16
Watchdog	1
Analog Comparators	2
Parallel Master Port	no
Real Time Clock	yes
Special Features	CAN Controller
Interface Type	CAN/I2C/I2S/SPI/UART
Programmability	yes
SPI	4
I2C	6
I2S	4
UART	8
USART	0
CAN	2
USB	0
Ethernet	0
Minimum Operating Supply Voltage (V)	1.08\|2.97
Typical Operating Supply Voltage (V)	1.2\|3.3
Maximum Operating Supply Voltage (V)	1.32\|3.63
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Temperature Flag	Opr
Supplier Temperature Rating	Industrial
Operating Supply Voltage (V)	1.2\|3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

Supplier packaging	LQFP
Basic package type	Lead-Frame SMT
Number of pins	144
Pin shape	Gull-wing
PCB	144
ears	N/R
Pin spacing (mm)	0.5
Package length (mm)	20.2(Max)
Package width (mm)	20.2(Max)
Package height (mm)	1.45(Max)
Package diameter (mm)	N/R
Package Overall Length (mm)	22.2(Max)
Package Overall Width (mm)	22.2(Max)
Package Overall Height (mm)	1.6(Max)
Mounting surface height (mm)	1.6(Max)
Install	Surface Mount
Package weight (g)	not applicable
Packaging materials	Plastic
package instruction	Low Profile Quad Flat Package
Package series name	QFP
JEDEC	MS-026BFB
Package outline	Link to datasheet

MSL	3
Maximum reflow temperature (°C)	260
Reflow soldering time (seconds)	30
Number of reflow cycles	3
standard	J-STD-020D
Reflow temperature source	Link to datasheet
Maximum wave soldering temperature (°C)	N/R
Wave soldering time (seconds)	N/R
Lead Finish(Plating)	Au
Plating materials	Pd over Ni
Terminal Base Material	Cu Alloy

Package

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