|
|
• DIGITAL OUTPUT: SPI-Compatible Interface
|
• ACCURACY:±1.5°C from −25°C to +85°C (max)
|
• LOW QUIESCENT CURRENT: 50µA (max)
|
• TINY SOT23-6 PACKAGE
|
• OPERATION TO 150°C
|
|
| CATALOG |
TMP121AIDBVR COUNTRY OF ORIGIN
|
TMP121AIDBVR PARAMETRIC INFO
|
TMP121AIDBVR PACKAGE INFO
|
TMP121AIDBVR MANUFACTURING INFO
|
TMP121AIDBVR PACKAGING INFO
|
TMP121AIDBVR ECAD MODELS
|
TMP121AIDBVR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
|
PARAMETRIC INFO
|
| Function |
Temperature Sensor |
| Interface Type |
Serial (SPI) |
| Resolution (bit) |
12+Sign |
| Output Type |
Digital |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Minimum Temperature Sensing (°C) |
-40 |
| Maximum Temperature Sensing (°C) |
125 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Operating Range |
-40°C to 125°C |
| Operating Temperature (°C) |
-40 to 125 |
| Maximum Supply Current (uA) |
50 |
| Accuracy |
±1.5°C |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Operating Supply Voltage (V) |
2.7 to 5.5 |
| Minimum Storage Temperature (°C) |
-60 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3(Max) |
| Package Overall Height (mm) |
1.45(Max) |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178AB |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
 |
|
| APPLICATIONS |
| • POWER-SUPPLY TEMPERATURE MONITORING |
| • COMPUTER PERIPHERAL THERMAL PROTECTION |
| • NOTEBOOK COMPUTERS |
| • CELL PHONES |
| • BATTERY MANAGEMENT |
| • OFFICE MACHINES |
| |
One-stop supplier of IC products