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• ±2.5°C Accuracy from –55°C to +130°C
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• Supply Voltage Range: 1.8 V to 5.5 V
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• Low Power: 4 µA (Maximum)
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| • MicroSize Packages: SOT-563, SC70-5 |
| • SC70 Pin-Compatible With LM20 |
| |
| CATALOG |
| TMP20AIDCKR COUNTRY OF ORIGIN |
TMP20AIDCKR PARAMETRIC INFO
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TMP20AIDCKR PACKAGE INFO
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TMP20AIDCKR MANUFACTURING INFO
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TMP20AIDCKR PACKAGING INFO
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TMP20AIDCKR EACD MODELS
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| TMP20AIDCKR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Thailand |
| China |
|
PARAMETRIC INFO
|
| Function |
Temperature Sensor |
| Sensor Gain |
-11.77mV/°C |
| Output Type |
Analog |
| Minimum Operating Supply Voltage (V) |
1.8 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Output Voltage (V) |
1.574(Typ) |
| Topology |
v(1,1) |
| Response Point List |
(-55,650.3m),(130,-1531.7m) |
| Minimum Temperature Sensing (°C) |
-55 |
| Maximum Temperature Sensing (°C) |
125 |
| Operating Range |
-55°C to 125°C |
| Operating Temperature (°C) |
-55 to 125 |
| Maximum Supply Current (uA) |
4 |
| Accuracy |
±2.5°C |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Output Driver |
CMOS |
| Operating Supply Voltage (V) |
1.8 to 5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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|
PACKAGE INFO
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| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
5 |
| Lead Shape |
Gull-wing |
| PCB |
5 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.15(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.15(Max) |
| Package Overall Width (mm) |
2.4(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-203 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
1 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
2.15 |
| Minimum PACKAGE_DIMENSION_L |
1.85 |
| Maximum PACKAGE_DIMENSION_W |
1.4 |
| Minimum PACKAGE_DIMENSION_W |
1.1 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
N/A |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni|PdNiAg |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4|9 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Cell Phones
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| • Desktop and Notebook Computers |
| • Portable Devices |
• Consumer Electronics
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| • Battery Management |
| • Power Supplies |
| • HVAC |
| • Thermal Monitoring |
| • Disk Drives |
| • Appliances and White Goods |
| • Automotive |
| |
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