TMP275AIDGKT Texas Instruments TMP275 ±0.5°C Temperature Sensor With I 2C and SMBus Interface in Industry Standard LM75 Form Factor and Pinout

Function	Temperature Sensor
Interface Type	Serial (2-Wire, I2C, SMBus)
Resolution (bit)	12
Output Type	Digital
Minimum Operating Supply Voltage (V)	2.7
Typical Operating Supply Voltage (V)	3.3\|5
Minimum Temperature Sensing (°C)	-40
Maximum Temperature Sensing (°C)	125
Maximum Operating Supply Voltage (V)	5.5
Maximum Output Voltage (V)	0.4
Minimum Output Voltage (V)	0
Maximum Rise Time (ns)	300
Maximum Fall Time (ns)	300
Operating Range	-40°C to 125°C
Operating Temperature (°C)	-40 to 125
Maximum Supply Current (uA)	85
Accuracy	±0.2°C
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	125
Output Driver	Open Drain
Operating Supply Voltage (V)	2.7 to 5.5
Minimum Storage Temperature (°C)	-60
Maximum Storage Temperature (°C)	130

Supplier Package	VSSOP
Basic Package Type	Lead-Frame SMT
Pin Count	8
Lead Shape	Gull-wing
PCB	8
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	3.1(Max)
Package Width (mm)	3.1(Max)
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	3.1(Max)
Package Overall Width (mm)	5.05(Max)
Package Overall Height (mm)	1.1(Max)
Seated Plane Height (mm)	1.1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Very Thin Shrink Small Outline Package
Package Family Name	SO
Jedec	MO-187
Package Outline	Link to Datasheet
Maximum PACKAGE_DIMENSION_H	0.95
Minimum PACKAGE_DIMENSION_H	N/A
Maximum PACKAGE_DIMENSION_L	3.1
Minimum PACKAGE_DIMENSION_L	2.9
Maximum PACKAGE_DIMENSION_W	3.1
Minimum PACKAGE_DIMENSION_W	2.9
Maximum Diameter	N/R
Minimum Diameter	N/R
Maximum Seated_Plane_Height	1.1
Minimum Seated_Plane_Height	N/A

MSL	2
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au\|AuAg
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy
Number of Wave Cycles	N/R

• Power-Supply Temperature Monitoring

• Computer Peripheral Thermal Protection

• Battery Management

• Office Machines

• Servers

• Thermostat Controls

• Environmental Monitoring and HVAC

• Electromechanical Device Temperature

• Data Logger