TMS320F28066PNT Texas Instruments TMS320F2806x Real-Time Microcontrollers

label:

2024/04/23 383

• Floating-Point Unit (FPU)– Native single-precision floating-point operations

• Programmable Control Law Accelerator (CLA)– 32-bit floating-point math accelerator– Executes code independently of the main CPU

• Viterbi, Complex Math, CRC Unit (VCU)– Extends C28x instruction set to support complex multiply, Viterbi operations, and Cyclic Redundency Check (CRC)

• Embedded memory– Up to 256KB of flash– Up to 100KB of RAM– 2KB of One-Time Programmable (OTP) ROM

• 6-channel Direct Memory Access (DMA)

• Endianness: Little endian

• JTAG boundary scan support– IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture

• Peripheral Interrupt Expansion (PIE) block that supports all peripheral interrupts

• Three 32-bit CPU timers

• Advanced control peripherals

• Motion detection

• Embedded temperature sensor

• Up to 4 High-Resolution Capture (HRCAP)modules

• Up to 2 Enhanced Quadrature Encoder Pulse(eQEP) modules

CATALOG

TMS320F28066PNT PARAMETRIC INFO

TMS320F28066PNT PACKAGE INFO

TMS320F28066PNT MANUFACTURING INFO

TMS320F28066PNT PACKAGING INFO

TMS320F28066PNT EACD MODELS

TMS320F28066PNT APPLICATIONS

PARAMETRIC INFO

Family Name	C2000
Data Bus Width (bit)	32
Device Core	C28x
Instruction Set Architecture	RISC
Maximum Clock Rate (MHz)	90
Program Memory Type	Flash
Program Memory Size	256KB
RAM Size	68KB
Maximum CPU Frequency (MHz)	90
Number of Programmable I/Os	40
Number of Timers	3
ADC Channels	12
ADC Resolution (bit)	12
Core Architecture	C28x
Number of ADCs	Single
Number of DACs	Triple
PWM	14
Watchdog	1
Analog Comparators	3
Special Features	CAN Controller
Interface Type	CAN/I2C/SCI/SPI/UART/USB
Programmability	Yes
SPI	2
I2C	1
I2S	0
UART	2
USART	0
CAN	1
USB	1
Ethernet	0
Minimum Operating Supply Voltage (V)	2.97
Typical Operating Supply Voltage (V)	3.3
Maximum Operating Supply Voltage (V)	3.63
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	105
Temperature Flag	Opr
Operating Supply Voltage (V)	3.3
Maximum Storage Temperature (°C)	150
Minimum Storage Temperature (°C)	-65

PACKAGE INFO

Supplier Package	LQFP
Basic Package Type	Lead-Frame SMT
Pin Count	80
Lead Shape	Gull-wing
PCB	80
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	12.2(Max)
Package Width (mm)	12.2(Max)
Package Height (mm)	1.45(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	14.2(Max)
Package Overall Width (mm)	14.2(Max)
Package Overall Height (mm)	1.6(Max)
Seated Plane Height (mm)	1.6(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Low Profile Quad Flat Package
Package Family Name	QFP
Jedec	MS-026BDD
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy