TPA2006D1DRBR Texas Instruments IC AMP AUDIO PWR 1.45W MONO 8SON

2025/06/25 112

CATALOG

China

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Malaysia

Amplifier Type	Class-D
Function	Speaker
Input Signal Type	Differential
Output Signal Type	Differential
Output Type	1-Channel Mono
Power Supply Type	Single
Minimum Single Supply Voltage (V)	2.5
Typical Single Supply Voltage (V)	3\|5
Maximum Single Supply Voltage (V)	5.5
Maximum Load Resistance (Ohm)	8
Typical Output Power (W)	1.45
Typical Output Power x Channels @ Load (W)	1.45x1@8Ohm
Maximum Power Dissipation (mW)	2700
Typical PSRR (dB)	75
Typical Quiescent Current (mA)	3.4@5.5V
Maximum Quiescent Current (mA)	4.9@5.5V
Minimum CMRR (dB)	68(Typ)
Total Harmonic Distortion Noise	0.19%@8Ohm@1W
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150

Supplier Package	VSON EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	8
Lead Shape	No Lead
PCB	8
Tab	N/R
Pin Pitch (mm)	0.65
Package Length (mm)	3.15(Max)
Package Width (mm)	3.15(Max)
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	3.15(Max)
Package Overall Width (mm)	3.15(Max)
Package Overall Height (mm)	1(Max)
Seated Plane Height (mm)	1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Very Thin Small Outline No Lead, Exposed Pad
Package Family Name	SON
Jedec	N/A
Package Outline	Link to Datasheet

MSL	2
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy