TPA4861DR Texas Instruments 1-W MONO AUDIO POWER AMPLIFIER

label:
2024/08/23 195
TPA4861DR Texas Instruments 1-W MONO AUDIO POWER AMPLIFIER


CATALOG
TPA4861DR COUNTRY OF ORIGIN
TPA4861DR PARAMETRIC INFO
TPA4861DR PACKAGE INFO
TPA4861DR MANUFACTURING INFO
TPA4861DR PACKAGING INFO
TPA4861DR ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)


PARAMETRIC INFO
Amplifier Type Class-AB
Function Speaker
Input Signal Type Single
Output Signal Type Differential
Output Type 1-Channel Mono
Power Supply Type Single
Minimum Single Supply Voltage (V) 2.7
Typical Single Supply Voltage (V) 3|5
Maximum Single Supply Voltage (V) 5.5
Maximum Load Resistance (Ohm) 8
Typical Output Power (W) 1.1
Typical Output Power x Channels @ Load (W) 1.1x1@8Ohm
Maximum Power Dissipation (mW) 725
Typical Gain Bandwidth Product (MHz) 1.5
Typical PSRR (dB) 70
Typical Supply Current (mA) 3.5@5V
Total Harmonic Distortion Noise 0.2%@8Ohm@1W
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ