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• AEC-Q101 qualified
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• IEC 61000-4-2 Level 4 ESD protection– ±25-kV (contact discharge)– ±30-kV (air-gap discharge)
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• ISO 10605 (330 pF, 330 Ω) ESD protection– ±20-kV (contact discharge)– ±25-kV (air-gap discharge)
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• IO capacitance 1.5-pF (typical)
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• DC breakdown voltage 6.5 V (minimum)
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• Ultra-low leakage current 10-nA (maximum)
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| CATALOG |
TPD2E2U06QDBZRQ1 COUNTRY OF ORIGIN
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TPD2E2U06QDBZRQ1 PARAMETRIC INFO
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TPD2E2U06QDBZRQ1 PACKAGE INFO
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TPD2E2U06QDBZRQ1 MANUFACTURING INFO
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TPD2E2U06QDBZRQ1 PACKAGING INFO
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TPD2E2U06QDBZRQ1 ECAD MODELS
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TPD2E2U06QDBZRQ1 APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Thailand
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Philippines
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PARAMETRIC INFO
|
| Type |
Diode Array |
| Direction Type |
Uni-Directional |
| Maximum Working Voltage (V) |
5.5 |
| Configuration |
Dual |
| Capacitance Value (pF) |
1.9 |
| Maximum Clamping Voltage (V) |
12.4(Typ) |
| Maximum Reverse Leakage Current (uA) |
0.01 |
| Number of Elements per Chip |
2 |
| Peak Pulse Power Dissipation (W) |
75@8/20us |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Supplier Temperature Grade |
Automotive |
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PACKAGE INFO
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| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
3 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.04(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
0.95 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.04(Max) |
| Package Overall Width (mm) |
2.64(Max) |
| Package Overall Height (mm) |
1.12(Max) |
| Seated Plane Height (mm) |
1.12(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
TO-236AB |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1|2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
| Tape Type |
Embossed |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • End equipment:– Head units– Rear seat entertainment– Telematics– Navigation modules– Media interfaces |
| • Interfaces:– USB 2.0– Ethernet™– Antenna– LVDS– I2C |
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