TPS22810DRVR Texas Instruments TPS22810, 2.7-18-V, 79-mΩ On-Resistance Load Switch With Thermal Protection

label:
2024/04/2 381



• Integrated Single Channel Load Switch
• Ambient Operating Temperature:–40°C to +105°C– SOT23-6 (DBV): 2-A Maximum ContinuousCurrent 1– WSON (DRV): 3-A Maximum Continuous Current 1
• Input Voltage Range: 2.7 V to 18 V
• Absolute Maximum Input Voltage: 20 V
• On-Resistance (RON)– RON = 79 mΩ (typical) at VIN = 12 V
• Quiescent Current– 62 µA (typical) at VIN = 12 V
• Shutdown Current– 500 nA (typical) at VIN = 12 V
• Thermal Shutdown
• Undervoltage Lock-Out (UVLO)
• Adjustable Quick Output Discharge (QOD)
• Configurable Rise Time With CT Pin
• SOT23-6 Package– 2.9-mm × 2.8-mm, 0.95-mm Pitch 1.45-mm Height (DBV)

• WSON Package– 2-mm × 2-mm, 0.65-mm Pitch 0.75-mm Height (DRV)
• ESD Performance Tested per JESD 22– ±2-kV HBM and ±1-kV CDM
CATALOG
TPS22810DRVR COUNTRY OF ORIGIN
TPS22810DRVR PARAMETRIC INFO
TPS22810DRVR PACKAGE INFO
TPS22810DRVR MANUFACTURING INFO
TPS22810DRVR PACKAGING INFO
TPS22810DRVR EACD MODELS
TPS22810DRVR APPLICATIONS


COUNTRY OF ORIGIN
Philippines
Thailand
China



PARAMETRIC INFO
type High Side
Number of Outputs 1
Maximum Input Voltage (V) 18
Minimum Output Current (A) 3(Max)
Minimum Operating Temperature (°C) -40
Minimum Input Voltage (V) 2.7
Maximum Operating Temperature (°C) 105
Switch On Resistance (Ohm) 0.086
Output Voltage Range (V) 18(Max)
Operating Supply Voltage Range (V) 2.7 to 18
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier packaging WSON EP
Basic package type Non-Lead-Frame SMT
Number of pins 6
Pin shape No Lead
PCB 6
ears N/R
Pin spacing (mm) 0.65
Package length (mm) 2.1(Max)
Package width (mm) 2.1(Max)
Package height (mm) 0.75(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 2.1(Max)
Package Overall Width (mm) 2.1(Max)
Package Overall Height (mm) 0.8(Max)
Mounting surface height (mm) 0.8(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Very Very Thin Small Outline No Lead Package, Exposed Pad
Package series name SON
JEDEC not applicable


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 30
Number of reflow cycles 3
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) N/R
Wave soldering time (seconds) N/R
Lead Finish(Plating) Au
Plating materials Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Package Tape and reel packaging
Packing quantity 3000
Reel Diameter (in) 7.09
Reel Width (mm) 8.4
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q2
packaging type file Link to datasheet


ECAD MODELS



APPLICATIONS
• HD TV
• Industrial Systems
• Set Top Box
• Surveillance systems
Продукт RFQ