|
|
• Integrated Single Load Switch
|
• Input Voltage Range: 1.4 V to 5.5 V
|
• 2-A Maximum Continuous Switch Current
|
• Low Threshold Control Input
|
• Controlled Slew-rate
|
|
| CATALOG |
TPS22912CYZVT COUNTRY OF ORIGIN
|
TPS22912CYZVT PARAMETRIC INFO
|
TPS22912CYZVT PACKAGE INFO
|
TPS22912CYZVT MANUFACTURING INFO
|
TPS22912CYZVT PACKAGING INFO
|
TPS22912CYZVT ECAD MODELS
|
TPS22912CYZVT APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Philippines
|
|
PARAMETRIC INFO
|
| Enable Logic |
Active High |
| Type |
High Side |
| Maximum Output Current (A) |
2 |
| Number of Outputs |
1 |
| Maximum Input Voltage (V) |
5.5 |
| Fault Protection |
Reverse Current Protection |
| Minimum Operating Temperature (°C) |
-40 |
| Number of Inputs |
1 |
| Maximum Operating Temperature (°C) |
85 |
| Output Type |
P-Channel |
| Minimum Input Voltage (V) |
1.4 |
| Number of Switches |
1 |
| Input Type |
Non-Inverting |
| Switch On Resistance (mOhm) |
61 |
| Interface Type |
On/Off |
| Output Voltage Range (V) |
5.5(Max) |
| Operating Supply Voltage Range (VDC) |
1.4 to 5.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
DSBGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
4 |
| Lead Shape |
Ball |
| PCB |
4 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
0.92(Max) |
| Package Width (mm) |
0.92(Max) |
| Package Height (mm) |
0.3(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
0.92(Max) |
| Package Overall Width (mm) |
0.92(Max) |
| Package Overall Height (mm) |
0.5(Max) |
| Seated Plane Height (mm) |
0.5(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Die Size Ball Grid Array |
| Package Family Name |
BGA |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnAgCu |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
|
|
ECAD MODELS
|
|
|
| APPLICATIONS |
| • Tablets and Set-Top-Boxes |
| • Portable Industrial / Medical Equipment |
| • Portable Media Players |
| • Point Of Sale Pins |
| • GPS Navigation Devices |
| • Digital Cameras |
| • Portable Instrumentation |
| • Smartphones / Wireless Handsets |
| |
One-stop supplier of IC products