 |
|
| • Integrated Single Channel Load Switch |
| • Input Voltage Range: 0.8 V to 5.7 V |
• Ultra-Low On Resistance (RON)
– RON = 16 mΩ at VIN = 5 V (VBIAS = 5 V)
– RON = 16 mΩ at VIN = 3.6 V (VBIAS = 5 V)
– RON = 16 mΩ at VIN = 1.8 V (VBIAS = 5 V)
|
| • 6-A Maximum Continuous Switch Current |
| • Low Quiescent Current (50 µA) |
| • Low Control Input Threshold Enables Use of
1.2-, 1.8-, 2.5-, and 3.3-V Logic |
| • Configurable Rise Time |
| • Quick Output Discharge (QOD) (Optional) |
| • SON 8-pin Package With Thermal Pad |
• ESD Performance Tested per JESD 22
– 2000-V HBM and 1000-V CDM |
|
| CATALOG |
| TPS22965DSGR COUNTRY OF ORIGIN |
| TPS22965DSGR PARAMETRIC INFO |
| TPS22965DSGR PACKAGE INFO |
| TPS22965DSGR MANUFACTURING INFO |
| TPS22965DSGR PACKAGING INFO |
| TPS22965DSGR ECAD MODELS |
| TPS22965DSGR FUNCTIONAL BLOCK DIAGRAM |
| TPS22965DSGR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Costa Rica |
| Japan |
| Philippines |
| Thailand |
|
| PARAMETRIC INFO |
| Enable Logic |
Active High |
| Type |
High Side |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
6 |
| Maximum Input Voltage (V) |
5.7 |
| Number of Inputs |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Output Type |
N-Channel |
| Minimum Input Voltage (V) |
0.8 |
| Maximum Operating Temperature (°C) |
105 |
| Number of Switches |
1 |
| Input Type |
Non-Inverting |
| Switch On Resistance (Ohm) |
0.016 |
| Output Voltage Range (V) |
-0.3 to 6 |
| Operating Supply Voltage Range (V) |
2.5 to 5.7 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
WSON EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
2.1(Max) |
| Package Width (mm) |
2.1(Max) |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.1(Max) |
| Package Overall Width (mm) |
2.1(Max) |
| Package Overall Height (mm) |
0.8(Max) |
| Seated Plane Height (mm) |
0.8(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Very Thin Small Outline No Lead Package, Exposed Pad |
| Package Family Name |
SON |
| Jedec |
MO-229 |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q2 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Ultrabook™
|
| • Notebooks and Netbooks |
| • Tablet PC |
| • Consumer Electronics |
| • Set-top Boxes and Residential Gateways |
| • Telecom Systems |
| • Solid State Drives (SSDs) |
|
One-stop supplier of IC products