|
|
• Integrated Single Channel Load Switch
|
• Input Voltage Range: 0.8 V to 5.7 V
|
• Ultra-Low On Resistance (RON)
– RON = 16 mΩ at VIN = 5 V (VBIAS = 5 V)
– RON = 16 mΩ at VIN = 3.6 V (VBIAS = 5 V)
– RON = 16 mΩ at VIN = 1.8 V (VBIAS = 5 V)
|
• 6-A Maximum Continuous Switch Current
|
• Low Quiescent Current (50 µA)
|
• Low Control Input Threshold Enables Use of1.2-, 1.8-, 2.5-, and 3.3-V Logic
|
• Configurable Rise Time
|
• Quick Output Discharge (QOD) (Optional)
|
• SON 8-pin Package With Thermal Pad
|
• ESD Performance Tested per JESD 22
– 2000-V HBM and 1000-V CDM
|
|
| CATALOG |
TPS22965DSGT COUNTRY OF ORIGIN
|
TPS22965DSGT PARAMETRIC INFO
|
TPS22965DSGT PACKAGE INFO
|
TPS22965DSGT MANUFACTURING INFO
|
TPS22965DSGT PACKAGING INFO
|
TPS22965DSGT ECAD MODELS
|
TPS22965DSGT FUNCTIONAL BLOCK DIAGRAM
|
TPS22965DSGT APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Philippines
|
Thailand
|
|
PARAMETRIC INFO
|
| Enable Logic |
Active High |
| Type |
High Side |
| Maximum Output Current (A) |
6 |
| Number of Outputs |
1 |
| Maximum Input Voltage (V) |
5.7 |
| Number of Inputs |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Input Voltage (V) |
0.8 |
| Output Type |
N-Channel |
| Maximum Operating Temperature (°C) |
105 |
| Number of Switches |
1 |
| Input Type |
Non-Inverting |
| Switch On Resistance (Ohm) |
0.016 |
| Output Voltage Range (V) |
-0.3 to 6 |
| Operating Supply Voltage Range (V) |
2.5 to 5.7 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
WSON EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
No Lead |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
2.1(Max) |
| Package Width (mm) |
2.1(Max) |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.1(Max) |
| Package Overall Width (mm) |
2.1(Max) |
| Package Overall Height (mm) |
0.8(Max) |
| Seated Plane Height (mm) |
0.8(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Very Thin Small Outline No Lead Package, Exposed Pad |
| Package Family Name |
SON |
| Jedec |
MO-229 |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
|
|
ECAD MODELS
|
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
APPLICATIONS
|
• Ultrabook™
|
• Notebooks and Netbooks
|
• Tablet PC
|
• Consumer Electronics
|
• Set-top Boxes and Residential Gateways
|
• Telecom Systems
|
• Solid State Drives (SSDs)
|
|
One-stop supplier of IC products