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• 4.2-V to 60-V Operating voltage, 62-V absolute maximum
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• Integrated reverse input polarity protection downto –60 V– Zero additional components required
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• Integrated back to back MOSFETs with 150-mΩtotal RON
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• 0.1-A to 2.23-A Adjustable current limit(±5% accuracy at 1 A) |
• Functional safety capable– Documentation available to aid functional safety system design |
• Load protection during Surge (IEC 61000-4-5)with minimum external components |
• IMON current indicator output (±8.5% accuracy) |
• Low quiescent current, 300-µA in operating, 20-µA in shutdown |
• Adjustable UVLO, OVP cut off, output slew rate control |
• Reverse current blocking |
• Fixed 38-V overvoltage clamp (TPS26602 only) |
• Available in easy-to-use 16-Pin HTSSOP and 24-Pin VQFN packages |
• Selectable current-limiting fault response options(Auto-Retry, Latch Off, Circuit Breaker Modes) |
• UL 2367 Recognized– File No. 169910– RILIM ≥ 5.36 kΩ (2.35-A maximum) |
• UL60950 - Safe during single point failure test– Open/Short ILIM detection |
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CATALOG |
TPS26600PWPR COUNTRY OF ORIGIN |
TPS26600PWPR PARAMETRIC INFO
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TPS26600PWPR PACKAGE INFO
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TPS26600PWPR MANUFACTURING INFO
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TPS26600PWPR PACKAGING INFO
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TPS26600PWPR EACD MODELS
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TPS26600PWPR APPLICATIONS |
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COUNTRY OF ORIGIN |
Malaysia |
Taiwan (Province of China) |
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PARAMETRIC INFO
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Type |
Positive Voltage |
Number of Channels |
1 |
External FET |
N-Channel |
Fault Management |
Auto-Retry |
External Sense Resistor |
No |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
PGOOD Output Logic |
Active Low |
Maximum Supply Current (mA) |
0.39 |
Minimum Operating Supply Voltage (V) |
4.2 |
Maximum Operating Supply Voltage (V) |
55 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
HTSSOP EP |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
16 |
Lead Shape |
Gull-wing |
PCB |
16 |
Tab |
N/R |
Pin Pitch (mm) |
0.65 |
Package Length (mm) |
5.1(Max) |
Package Width (mm) |
4.5(Max) |
Package Height (mm) |
1.05(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5.1(Max) |
Package Overall Width (mm) |
6.6(Max) |
Package Overall Height (mm) |
1.2(Max) |
Seated Plane Height (mm) |
1.2(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
Package Family Name |
SO |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu Alloy |
Number of Wave Cycles |
N/R |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2000 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q1 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS |
• Programmable logic controller
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• Distributed Control System (DCS) |
• Control and automation |
• Redundant supply ORing |
• Industrial surge protection |
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