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• Configurable Turnon and Turnoff Slew Rate
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• Supports a Wide Range of VIN 1.2 V Up to 8 V
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• Excellent OFF Isolation Even Under Fast Input Transients
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| • 1.0V up to 8V NMOS Control Logic Interface With Configurable Hystersis
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| • Fully Protected Against ESD (All Pins) – HBM 2000 V, CDM 500 V |
| • Very Low ON-state Quiescent Current (Down to 1.2 µA) |
| • Very Low OFF-state Leakage Current (Typical 100 nA)
|
| • Available in 2.9 mm × 1.6 mm x 0.75mm SOT-23 (DDC) Package
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|
| CATALOG |
| TPS27082LDDCR COUNTRY OF ORIGIN |
TPS27082LDDCR PARAMETRIC INFO
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TPS27082LDDCR PACKAGE INFO
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TPS27082LDDCR MANUFACTURING INFO
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TPS27082LDDCR PACKAGING INFO
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TPS27082LDDCR ECAD MODELS
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TPS27082LDDCR APPLICATIONS
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| COUNTRY OF ORIGIN |
| China |
| Philippines |
| Malaysia |
|
PARAMETRIC INFO
|
| Type |
High Side |
| Number of Outputs |
1 |
| Maximum Input Voltage (V) |
8 |
| Minimum Output Current (A) |
3(Max) |
| Minimum Operating Temperature (°C) |
-40 |
| Minimum Input Voltage (V) |
1.2 |
| Maximum Operating Temperature (°C) |
125 |
| Switch On Resistance (Ohm) |
0.155 |
| Output Voltage Range (V) |
-0.1 to 8 |
| Maximum Power Dissipation (mW) |
1190 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
TSOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Thin Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-193AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
9.5 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• High-Side Load Switches
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• Inrush-current Controls
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| • Power Sequencing and Controls
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| • Stand-by Power Isolation
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• Portable Power Switches
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