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| CATALOG |
TPS3619-33DGKR COUNTRY OF ORIGIN
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TPS3619-33DGKR PARAMETRIC INFO
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TPS3619-33DGKR PACKAGE INFO
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TPS3619-33DGKR MANUFACTURING INFO
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TPS3619-33DGKR PACKAGING INFO
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TPS3619-33DGKR ECAD MODELS
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COUNTRY OF ORIGIN
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Thailand
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China
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Malaysia
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PARAMETRIC INFO
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| Output Driver |
Active Low/Push-Pull |
| Manual Reset |
Yes |
| Watchdog Timer |
No |
| Number of Supervisors |
1 |
| Typical Reset Threshold Voltage (V) |
2.93 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Chip Enable Signals |
No |
| Power Fail Detection |
Yes |
| Battery Backup Switching |
Yes |
| Maximum Reset Active Time (ms) |
140 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Minimum Reset Threshold Voltage (V) |
2.88 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Reset Threshold Voltage (V) |
3 |
| Monitored Voltage (V) |
3.3|5 |
| Maximum Power Dissipation (mW) |
470 |
| Maximum Supply Current (uA) |
40 |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Supplier Temperature Grade |
Industrial |
| Type |
Voltage Monitor |
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PACKAGE INFO
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| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_H |
0.95 |
| Minimum PACKAGE_DIMENSION_H |
N/A |
| Maximum PACKAGE_DIMENSION_L |
3.1 |
| Minimum PACKAGE_DIMENSION_L |
2.9 |
| Maximum PACKAGE_DIMENSION_W |
3.1 |
| Minimum PACKAGE_DIMENSION_W |
2.9 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Maximum Seated_Plane_Height |
1.1 |
| Minimum Seated_Plane_Height |
N/A |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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