TPS3700DDCT Texas Instruments IC COMP WINDOW W/REF 6SOT

label:
2024/01/2 265


• Wide supply voltage range: 1.8 V to 18 V
• Adjustable threshold: down to 400 mV
• High threshold accuracy:
   – 1.0% over temperature
   – 0.25% (Typical)
• Low quiescent current: 5.5 µA (Typical)  
• Open-drain outputs for overvoltage and undervoltage detection
• Internal hysteresis: 5.5 mV (Typ)
• Temperature range: –40°C to 125°C  
• Packages:
   – SOT-6
   – 1.5-mm × 1.5-mm WSON-6


CATALOG
TPS3700DDCT COUNTRY OF ORIGIN
TPS3700DDCT PARAMETRIC INFO
TPS3700DDCT PACKAGE INFO
TPS3700DDCT MANUFACTURING INFO
TPS3700DDCT PACKAGING INFO
TPS3700DDCT ECAD MODELS
TPS3700DDCT FUNCTIONAL BLOCK DIAGRAM
TPS3700DDCT APPLICATIONS


COUNTRY OF ORIGIN
China
Philippines
Thailand
Malaysia


PARAMETRIC INFO
Output Driver Active Low/Open Drain
Manual Reset No
Watchdog Timer No
Number of Supervisors 2
Typical Reset Threshold Voltage (V) 0.4
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Chip Enable Signals No
Power Fail Detection No
Battery Backup Switching No
Maximum Operating Supply Voltage (V) 18
Minimum Reset Threshold Voltage (V) 0.396
Maximum Reset Threshold Voltage (V) 0.404
Maximum Supply Current (uA) 7(Typ)
Minimum Operating Supply Voltage (V) 1.8
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Type Voltage Detector
Programmability No
 


PACKAGE INFO
Supplier Package TSOT-23
Basic Package Type Lead-Frame SMT
Pin Count 6
Lead Shape Gull-wing
PCB 6
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3.05(Max)
Package Overall Height (mm) 1.1(Max)
Seated Plane Height (mm) 1.1(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Thin Small Outline Transistor
Package Family Name SOT
Jedec MO-193AA
Package Outline Link to Datasheet
 


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
 


PACKAGING INFO
Packaging Suffix T
Packaging Tape and Reel
Quantity Of Packaging 250
Reel Diameter (in) 7.05
Reel Width (mm) 8.4
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet
 


ECAD MODELS


FUNCTIONAL BLOCK DIAGRAM


APPLICATIONS
• Industrial control systems
• Automotive systems
• Embedded computing modules
• DSP, microcontroller, or microprocessor applications  
• Notebook and desktop computers
• Portable- and battery-powered products
• FPGA and ASIC applications
Продукт RFQ