|
|
• Power-on reset generator with adjustable delay time: 1.25 ms to 10 s
|
• Very low quiescent current: 2.4 μA typical
|
• High threshold accuracy: 0.5% typical
|
• Temperature range: –40°C to 125°C
|
• Small SOT-23 and 2-mm × 2-mm WSON packages
|
|
| CATALOG |
TPS3808G01DBVR COUNTRY OF ORIGIN
|
TPS3808G01DBVR PARAMETRIC INFO
|
TPS3808G01DBVR PACKAGE INFO
|
TPS3808G01DBVR MANUFACTURING INFO
|
TPS3808G01DBVR PACKAGING INFO
|
TPS3808G01DBVR ECAD MODELS
|
TPS3808G01DBVR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Thailand
|
Malaysia
|
Philippines
|
|
PARAMETRIC INFO
|
| Output Driver |
Active Low/Open Drain |
| Manual Reset |
Yes |
| Watchdog Timer |
No |
| Number of Supervisors |
1 |
| Typical Reset Threshold Voltage (V) |
Adj |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Chip Enable Signals |
No |
| Power Fail Detection |
No |
| Battery Backup Switching |
No |
| Maximum Reset Active Time (ms) |
1200(Typ) |
| Maximum Operating Supply Voltage (V) |
6.5 |
| Minimum Reset Threshold Voltage (V) |
Adj |
| Maximum Reset Threshold Voltage (V) |
Adj |
| Monitored Voltage (V) |
0.4 to 5 |
| Maximum Supply Current (uA) |
2.7(Typ) |
| Minimum Operating Supply Voltage (V) |
1.65 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Type |
Voltage Supervisory |
| Programmability |
Yes |
|
|
PACKAGE INFO
|
| Supplier Package |
SOT-23 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.95 |
| Package Length (mm) |
3.05(Max) |
| Package Width (mm) |
1.75(Max) |
| Package Height (mm) |
1.1 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.05(Max) |
| Package Overall Width (mm) |
3(Max) |
| Package Overall Height (mm) |
1.45(Max) |
| Seated Plane Height (mm) |
1.45(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-178 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
4 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Shelf Life Period |
5 Years |
| Shelf Life Condition |
N/A |
| Number of Wave Cycles |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7.09 |
| Reel Width (mm) |
8.4 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • DSP or microcontroller applications |
| • Notebook and desktop computers |
| • PDAs and hand-held products |
| • Portable and battery-powered products |
| • FPGA and ASIC applications |
| |
One-stop supplier of IC products