
|
|
• VR12.1 serial VID (SVID) compliant
|
• 1- or 2-phase operation
|
• Supports only zero load line applications
|
• 8-Bit DAC output range: 0.25 V to 1.52 V
|
• Optimized efficiency at light and heavy loads
|
• 8 independent levels of overshoot reduction (OSR) and undershoot reduction (USR)
|
|
CATALOG |
TPS51623RSMR COUNTRY OF ORIGIN
|
TPS51623RSMR PARAMETRIC INFO
|
TPS51623RSMR PACKAGE INFO
|
TPS51623RSMR MANUFACTURING INFO
|
TPS51623RSMR PACKAGING INFO
|
TPS51623RSMR ECAD MODELS
|
TPS51623RSMR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
China
|
Philippines
|
Malaysia
|
|
PARAMETRIC INFO
|
Topology |
Step Down |
Number of Outputs |
1 |
Maximum Switching Frequency (kHz) |
1000 |
Output Voltage (V) |
0.5 to 1.5 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
105 |
Maximum Input Voltage (V) |
28 |
Minimum Input Voltage (V) |
4.5 |
Synchronous Rectifier |
Yes |
Synchronous Clock |
No |
Minimum Switching Frequency (kHz) |
300 |
Maximum Output Current (A) |
60 |
Programmability |
No |
Typical Quiescent Current (mA) |
0.5 |
|
|
PACKAGE INFO
|
Supplier Package |
VQFN EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
32 |
Lead Shape |
No Lead |
PCB |
32 |
Tab |
N/R |
Pin Pitch (mm) |
0.4 |
Package Length (mm) |
4.15(Max) |
Package Width (mm) |
4.15(Max) |
Package Height (mm) |
0.95(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
4.15(Max) |
Package Overall Width (mm) |
4.15(Max) |
Package Overall Height (mm) |
1(Max) |
Seated Plane Height (mm) |
1(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Very Thin Quad Flat No Lead Package, Exposed Pad |
Package Family Name |
QFN |
Jedec |
N/A |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
MSL |
1 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Au |
Under Plating Material |
Pd over Ni |
Terminal Base Material |
Cu |
|
|
PACKAGING INFO
|
Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
3000 |
Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS |
|
|
APPLICATIONS |
• Adapter |
• Battery |
• NVDC |
• 5-V or 12-V Rails |
|