 |
|
| • Small 3.5-mm × 3.5-mm HotRod™ QFN package |
| • Integrated 14.1-mΩ and 6.1-mΩ MOSFETs |
| • Peak current mode control with fast transient
response |
| • 200-kHz to 1.6-MHz fixed switching frequency
|
| • Synchronizes to external clock |
| • 0.6-V voltage reference ±0.85% over temperature |
| • 0.6-V to 12-V output voltage range
|
| • Hiccup Current Limit |
| • Safe start-up into pre-biased output voltage |
| • Adjustable soft start and power sequencing
|
| • Adjustable input undervoltage lockout |
| • 3-µA shutdown current |
| • Power good output monitor for undervoltage and
overvoltage |
| • Output overvoltage protection |
| • Non-latch thermal shutdown protection
|
| • –40°C to 150°C operating junction temperature |
|
| CATALOG |
| TPS54824RNVR COUNTRY OF ORIGIN |
| TPS54824RNVR PARAMETRIC INFO |
| TPS54824RNVR PACKAGE INFO |
| TPS54824RNVR MANUFACTURING INFO |
| TPS54824RNVR PACKAGING INFO |
| TPS54824RNVR ECAD MODELS |
| TPS54824RNVR FUNCTIONAL BLOCK DIAGRAM
|
| TPS54824RNVR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Philippines |
|
| PARAMETRIC INFO |
| Type |
Synchronous Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
4.5 |
| Maximum Input Voltage (V) |
17 |
| Output Voltage (V) |
0.6 to 12 |
| Maximum Output Current (A) |
8 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
150 |
| Switching Frequency (kHz) |
1600 |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
4.5 to 17 |
| Output Type |
Adjustable |
| Typical Quiescent Current (uA) |
580 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
12.9 |
|
|
| PACKAGE INFO |
| Supplier Package |
VQFN-HR |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
18 |
| Lead Shape |
No Lead |
| PCB |
18 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5|0.65 |
| Package Length (mm) |
3.6(Max) |
| Package Width (mm) |
3.6(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Quad Flat No Lead Package |
| Package Family Name |
QFN |
| Jedec |
N/A |
|
|
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Telecom and wireless infrastructure |
| • Test and measurement |
| • Medical imaging equipment |
| • Enterprise switching |
| • Server |
| |
| |
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