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• DCS-Control topology
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• Up to 95% efficiency
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• 26-mΩ and 26-mΩ internal power MOSFETs
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| • 2.4-V to 5.5-V input voltage range
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| • 4-μA operating quiescent current |
| • 1% output voltage accuracy |
| • 4-MHz switching frequency |
| • Power save mode for light-load efficiency |
| • A forced-PWM version for CCM operation |
| • 100% duty cycle for lowest dropout |
| • Active output discharge |
| • Power good output |
| • Thermal shutdown protection |
| • Hiccup short-circuit protection |
| • Available in 6-pin WCSP and PowerWCSP with 0.4-mm pitch |
| • 0.3-mm tall YWC package supports embedded systems |
| • Supports 12 mm2 solution size |
| • Supports < 0.6 mm height solution |
| • Create a custom design using the TPS62088 with the WEBENCH® Power Designer |
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| CATALOG |
TPS6208833YFPR PARAMETRIC INFO
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TPS6208833YFPR PACKAGE INFO
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TPS6208833YFPR MANUFACTURING INFO
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TPS6208833YFPR PACKAGING INFO
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TPS6208833YFPR EACD MODELS
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| TPS6208833YFPR APPLICATIONS |
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PARAMETRIC INFO
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| Minimum Operating Temperature (°C) |
-40 |
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PACKAGE INFO
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| Supplier Package |
DSBGA |
| Basic Package Type |
Ball Grid Array |
| Pin Count |
6 |
| Lead Shape |
Ball |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.4 |
| Package Length (mm) |
1.19(Max) |
| Package Width (mm) |
0.79(Max) |
| Package Height (mm) |
0.31(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.5(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Die Size Ball Grid Array |
| Package Family Name |
BGA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Lead Finish(Plating) |
SnAgCu |
|
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PACKAGING INFO
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| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
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ECAD MODELS
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| APPLICATIONS |
| • Solid-state drives |
| • Wearable products |
| • Smartphones |
| • Camera modules |
• Optical modules
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