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• Input Voltage Range VIN from 2.2V to 5.5
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• Typ. 360nA Quiescent Current
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• Up to 90% Efficiency at 10µA Output Current
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• RF Friendly DCS-Control TM
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• Up to 2 MHz Switching Frequency
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• Low Output Ripple Voltage
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• Automatic Transition to No Ripple 100% Mode
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| CATALOG |
TPS62742DSST COUNTRY OF ORIGIN
|
TPS62742DSST PARAMETRIC INFO
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TPS62742DSST PACKAGE INFO
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TPS62742DSST MANUFACTURING INFO
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TPS62742DSST PACKAGING INFO
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TPS62742DSST ECAD MODELS
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TPS62742DSST APPLICATIONS
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COUNTRY OF ORIGIN
|
China
|
Malaysia
|
Philippines
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PARAMETRIC INFO
|
| Type |
Step Down |
| Number of Outputs |
1 |
| Minimum Input Voltage (V) |
2.2 |
| Maximum Input Voltage (V) |
5.5 |
| Output Voltage (V) |
1.8 to 3.3 |
| Maximum Output Current (A) |
0.4 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Switching Frequency (kHz) |
2000 |
| Switching Regulator |
Yes |
| Operating Supply Voltage (V) |
2.2 to 5.5 |
| Output Type |
Adjustable |
| Load Regulation |
0.001%/mA |
| Line Regulation |
0%/V |
| Typical Quiescent Current (uA) |
12.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Typical Switch Current (A) |
0.65 |
|
|
PACKAGE INFO
|
| Supplier Package |
WSON EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
12 |
| Lead Shape |
No Lead |
| PCB |
12 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
2.1(Max) |
| Package Height (mm) |
0.75(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
2.1(Max) |
| Package Overall Height (mm) |
0.8(Max) |
| Seated Plane Height (mm) |
0.8(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Very Thin Small Outline No Lead Package, Exposed Pad |
| Package Family Name |
SON |
| Package Outline |
Link to Datasheet |
|
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MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
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PACKAGING INFO
|
| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
250 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
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| APPLICATIONS |
| • Bluetooth® Low Energy, RF4CE, Zigbee |
| • Industrial Metering |
| • Energy Harvesting |
| |
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