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• 1.6 A, 97% Efficient Step-Down Converter for System Voltage (VDCDC1)– 3.3 V, 2.8 V, or Adjustable
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• 0.8 A, up to 95% Efficient Step-Down Converter for Memory Voltage (VDCDC2)– 1.8 V, 2.5 V, or Adjustable
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• 0.8 A, 90% Efficient Step-Down Converter for Processor Core (VDCDC3)
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| • Adjustable Output Voltage on VDCDC3
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| • 30-mA LDO for Vdd_alive |
| • 2 × 200 mA General-Purpose LDOs (LDO1 and LDO2) |
| • Dynamic Voltage Management for Processor Core |
| • LDO1 and LDO2 Voltage Externally Adjustable |
| • Separate Enable Pins for Inductive Converters |
| • 2.25-MHz Switching Frequency |
| • 85-μA Quiescent Current |
| • Thermal Shutdown Protection |
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| CATALOG |
| TPS650250RHBR COUNTRY OF ORIGIN |
TPS650250RHBR PARAMETRIC INFO
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TPS650250RHBR PACKAGE INFO
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TPS650250RHBR MANUFACTURING INFO
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TPS650250RHBR PACKAGING INFO
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TPS650250RHBR EACD MODELS
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| TPS650250RHBR APPLICATIONS |
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| COUNTRY OF ORIGIN |
| Malaysia |
| Thailand |
| China |
| Philippines |
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PARAMETRIC INFO
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| Function |
Li-Ion Powered System |
| Input Voltage (V) |
2.5 to 6 |
| Switching Frequency (kHz) |
2250 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Supply Voltage (V) |
2.5 |
| Maximum Operating Supply Voltage (V) |
6 |
| Maximum Power Dissipation (mW) |
2850 |
| Process Technology |
MOSFET |
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PACKAGE INFO
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| Supplier packaging |
VQF |
| Basic package type |
Non-Lead-Frame SMT |
| Number of pins |
32 |
| Pin shape |
No Lead |
| PCB |
32 |
| ears |
N/R |
| Pin spacing (mm) |
0.5 |
| Package length (mm) |
5.1(Max) |
| Package width (mm) |
5.1(Max) |
| Package height (mm) |
0.95(Max) |
| Package diameter (mm) |
N/R |
| Package Overall Length (mm) |
5.1(Max) |
| Package Overall Width (mm) |
5.1(Max) |
| Package Overall Height (mm) |
1(Max) |
| Mounting surface height (mm) |
1(Max) |
| Install |
Surface Mount |
| Package weight (g) |
not applicable |
| Packaging materials |
Plastic |
| package instruction |
Very Thin Quad Flat No Lead Package, Exposed Pad |
| Package series name |
QFN |
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MANUFACTURING INFO
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| MSL |
2 |
| Maximum reflow temperature (°C) |
260 |
| Reflow soldering time (seconds) |
30 |
| Number of reflow cycles |
3 |
| standard |
J-STD-020D |
| Reflow temperature source |
Link to datasheet |
| Maximum wave soldering temperature (°C) |
N/R |
| Wave soldering time (seconds) |
N/R |
| Lead Finish(Plating) |
Au |
| Plating materials |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging Suffix |
R |
| Package |
Tape and reel packaging |
| Packing quantity |
3000 |
| packaging type file |
Link to datasheet |
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ECAD MODELS
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| APPLICATIONS |
| • Cellular, Smart Phones |
| • GPS |
| • Digital Still Cameras |
| • Split Supply DSP and μP Solutions |
| • Samsung ARM-Based Processors |
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