TPS73733DCQR Texas Instruments IC REG LINEAR 3.3V 1A SOT223-6

label:
2025/04/30 37
TPS73733DCQR Texas Instruments 	IC REG LINEAR 3.3V 1A SOT223-6


• Stable with 1μF or larger ceramic output capacitor
• Input voltage range: 2.2V to 5.5V
• Ultra-low dropout voltage– Legacy silicon: 130mV typical at 1A– New silicon: 122mV typical at 1A
• Excellent load transient response—even with only 1μF output capacitor

CATALOG
TPS73733DCQR COUNTRY OF ORIGIN
TPS73733DCQR PARAMETRIC INFO
TPS73733DCQR PACKAGE INFO
TPS73733DCQR MANUFACTURING INFO
TPS73733DCQR PACKAGING INFO
TPS73733DCQR ECAD MODELS
TPS73733DCQR APPLICATIONS


COUNTRY OF ORIGIN
China
Thailand
Malaysia


PARAMETRIC INFO
Type LDO
Number of Outputs 1
Maximum Output Current (A) 1
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Output Type Fixed
Output Voltage Range (V) 1.8 to 10
Junction to Ambient 53.1°C/W
Junction to Case 35.2°C/W
Polarity Positive
Special Features Current Limit|Fault Protection|Thermal Shutdown Protection
Process Technology NMOS
Load Regulation 0.002%/mA(Typ)
Line Regulation 0.01%/V(Typ)
Maximum Dropout Voltage @ Current (V) 0.5@1A
Minimum Input Voltage (V) 2.2
Maximum Input Voltage (V) 5.5
Output Voltage (V) 3.3
Typical Quiescent Current (mA) 0.4
Typical Dropout Voltage @ Current (V) 0.13@1A
Reference Voltage (V) 1.204(Typ)
Accuracy (%) ±1
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Typical PSRR (dB) 58
Typical Output Capacitance (uF) 1(Min)
Typical Output Noise Voltage (uVrms) 48
Pass Element Type NMOS
Output Capacitor Type Ceramic


PACKAGE INFO
Supplier Package SOT-223
Basic Package Type Lead-Frame SMT
Pin Count 6
Lead Shape Gull-wing
PCB 5
Tab Tab
Pin Pitch (mm) 1.27
Package Length (mm) 6.55(Max)
Package Width (mm) 3.55(Max)
Package Height (mm) 1.65(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.8(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material N/A
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Reel Width (mm) 12.4
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q3
Packaging Document Link to Datasheet


ECAD MODELS
APPLICATIONS
• Point-of-load regulation for DSPs, FPGAs, ASICs, and microprocessors
• Post-regulation for switching supplies
Продукт RFQ