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• Stable with 1μF or larger ceramic output capacitor
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• Input voltage range: 2.2V to 5.5V
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• Ultra-low dropout voltage– Legacy silicon: 130mV typical at 1A– New silicon: 122mV typical at 1A
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• Excellent load transient response—even with only 1μF output capacitor
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CATALOG |
TPS73733DCQR COUNTRY OF ORIGIN
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TPS73733DCQR PARAMETRIC INFO
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TPS73733DCQR PACKAGE INFO
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TPS73733DCQR MANUFACTURING INFO
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TPS73733DCQR PACKAGING INFO
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TPS73733DCQR ECAD MODELS
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TPS73733DCQR APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Thailand
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Malaysia
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PARAMETRIC INFO
|
Type |
LDO |
Number of Outputs |
1 |
Maximum Output Current (A) |
1 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Output Type |
Fixed |
Output Voltage Range (V) |
1.8 to 10 |
Junction to Ambient |
53.1°C/W |
Junction to Case |
35.2°C/W |
Polarity |
Positive |
Special Features |
Current Limit|Fault Protection|Thermal Shutdown Protection |
Process Technology |
NMOS |
Load Regulation |
0.002%/mA(Typ) |
Line Regulation |
0.01%/V(Typ) |
Maximum Dropout Voltage @ Current (V) |
0.5@1A |
Minimum Input Voltage (V) |
2.2 |
Maximum Input Voltage (V) |
5.5 |
Output Voltage (V) |
3.3 |
Typical Quiescent Current (mA) |
0.4 |
Typical Dropout Voltage @ Current (V) |
0.13@1A |
Reference Voltage (V) |
1.204(Typ) |
Accuracy (%) |
±1 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
Typical PSRR (dB) |
58 |
Typical Output Capacitance (uF) |
1(Min) |
Typical Output Noise Voltage (uVrms) |
48 |
Pass Element Type |
NMOS |
Output Capacitor Type |
Ceramic |
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PACKAGE INFO
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Supplier Package |
SOT-223 |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
6 |
Lead Shape |
Gull-wing |
PCB |
5 |
Tab |
Tab |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
6.55(Max) |
Package Width (mm) |
3.55(Max) |
Package Height (mm) |
1.65(Max) |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
1.8(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline Transistor |
Package Family Name |
SOT |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A |
Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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Packaging Suffix |
R |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
Reel Diameter (in) |
13 |
Reel Width (mm) |
12.4 |
Tape Pitch (mm) |
8 |
Tape Width (mm) |
12 |
Component Orientation |
Q3 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS |
• Point-of-load regulation for DSPs, FPGAs, ASICs, and microprocessors |
• Post-regulation for switching supplies |
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