 |
|
| • Qualified for Automotive Applications |
• AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 1:
–40°C to 125°C
Ambient Operating Temperature Range
– Device HBM ESD Classification Level H2
– Device CDM ESD Classification Level C4B
|
| • 1-A Low-Dropout (LDO) Voltage Regulator |
| • Available in 1.8-V, 2.5-V, 3.3-V, and 5-V FixedOutput and an Adjustable Version |
| • Dropout Voltage Down to 230 mV at 1 A
(TPS76850-Q1)
|
| • Ultralow 85-μA Typical Quiescent Current |
| • Fast Transient Response |
| • 2% Tolerance Over Specified Conditions for
Fixed-Output Versions
|
| • Open-Drain Power Good (See TPS767xx-Q1 for
Power-On Reset With 200-ms Delay Option)
|
| • 20-Pin TSSOP (PWP) Package |
| • Thermal Shutdown Protection
|
|
| CATALOG |
| TPS76833QPWPRQ1 Country of Origin |
| TPS76833QPWPRQ1 Parametric Info |
| TPS76833QPWPRQ1 Package Info |
| TPS76833QPWPRQ1 Manufacturing Info |
| TPS76833QPWPRQ1 Packaging Info |
| TPS76833QPWPRQ1 ECAD Models |
| TPS76833QPWPRQ1 Functional Block Diagrams |
| TPS76833QPWPRQ1 Applications |
|
| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
|
| PARAMETRIC INFO |
| Type |
LDO |
| Number of Outputs |
1 |
| Maximum Output Current (A) |
1 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Output Type |
Fixed |
| Output Voltage Range (V) |
1.8 to 10 |
| Junction to Ambient |
32.6°C/W |
| Polarity |
Positive |
| Special Features |
Current Limit|Thermal Shutdown Protection |
| Load Regulation |
3mV(Typ) |
| Line Regulation |
0.01%(Typ) |
| Maximum Quiescent Current (mA) |
0.125 |
| Maximum Dropout Voltage @ Current (V) |
0.575@1A |
| Minimum Input Voltage (V) |
2.7 |
| Maximum Input Voltage (V) |
10 |
| Output Voltage (V) |
3.3 |
| Typical Quiescent Current (mA) |
0.085 |
| Typical Dropout Voltage @ Current (V) |
0.35@1A |
| Accuracy (%) |
±2 |
| Supplier Temperature Grade |
Automotive |
| Typical PSRR (dB) |
60 |
| Typical Output Capacitance (uF) |
10(Min) |
| Typical Output Noise Voltage (uVrms) |
55 |
|
|
| PACKAGE INFO |
| Supplier Package |
HTSSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
20 |
| Lead Shape |
Gull-wing |
| PCB |
20 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
6.6(Max) |
| Package Width (mm) |
4.5(Max) |
| Package Height (mm) |
1.05(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6.6(Max) |
| Package Overall Width (mm) |
6.6(Max) |
| Package Overall Height (mm) |
1.2(Max) |
| Seated Plane Height (mm) |
1.2(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Heat Sinked Thin Shrink Small Outline Package, Exposed Pad |
| Package Family Name |
SO |
| Jedec |
MO-153ACT |
| Package Outline |
Link to Datasheet |
|
|
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Packaging Document |
Link to Datasheet |
|
|
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAMS |
 |
|
| APPLICATIONS |
| • Automotive |
| • Power Train |
| • Cluster |
| • ADAS |
|
|
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